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"chiu tz cheng"的相關文件
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| 國立成功大學 |
2016-09 |
On the mechanics of laser peeling for ultra-thin glasses
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Chiu, Tz-Cheng; Hua, Chi-An; Wang, Chih-Han; Chen, Kuo-Shen; Yang, Tian-Shiang; Wen, Chang-Da; Li, Chun-Han; Lin, Mao-Chi; Huang, Chien-Jung; Chen, Kun-Tso |
| 國立成功大學 |
2015-10 |
In Situ Synchrotron X-ray Diffraction Measurement of the Strain Distribution in Si Die for the Embedded Substrates
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Hsu, Hsueh Hsien; Chen, Hao; Ouyang, Yao Tsung; Chiu, Tz Cheng; Chang, Tao Chih; Lee, Hsin Yi; Ku, Chin Shun; Wu, Albert T. |
| 國立成功大學 |
2014-08 |
Temperature distribution and heat flow around a crack of arbitrary orientation in a functionally graded medium
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Tsai, Shang-Wu; Chiu, Tz-Cheng; Chue, Ching-Hwei |
| 國立成功大學 |
2014-01 |
Evaluation of Strain Measurement in a Die-to-Interposer Chip Using In Situ Synchrotron X-Ray Diffraction and Finite-Element Analysis
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Hsu, Hsueh-Hsien; Chiu, Tz-Cheng; Chang, Tao-Chih; Huang, Shin-Yi; Lee, Hsin-Yi; Ku, Ching-Shun; Lin, Yang-Yi; Su, Chien-Hao; Chou, Li-Wei; Ouyang, Yao-Tsung; Huang, Yi-Ting; Wu, Albert T. |
| 國立成功大學 |
2013-12 |
Heat conduction in a functionally graded medium with an arbitrarily oriented crack
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Chiu, Tz-Cheng; Tsai, Shang-Wu; Chue, Ching-Hwei |
| 國立成功大學 |
2012-07 |
A numerical procedure for simulating delamination growth on interfaces of interconnect structures
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Chiu, Tz-Cheng; Chen, Chun-Hui |
| 國立成功大學 |
2011-06 |
Effects of Curing and Chemical Aging on Warpage-Characterization and Simulation
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Chiu, Tz-Cheng; Kung, Che-Li; Huang, Hong-Wei; Lai, Yi-Shao |
| 國立成功大學 |
2009-03 |
Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique
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Chiu, Tz-Cheng; Lin, Huang-Chun |
| 國立成功大學 |
2008-06 |
On the homogenization of multilayered interconnect for interfacial fracture analysis
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Chiu, Tz-Cheng; Lin, Huang-Chun |
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