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Showing items 1-5 of 5 (1 Page(s) Totally)
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| 國立成功大學 |
2013 |
Use of 3,3-Thiobis(1-propanesulfonate) to Accelerate Microvia Filling by Copper Electroplating
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Chan, Po-Fan; Chiu, Yong-Da; Dow, Wei-Ping; Krug, Klaus; Lee, Yuh-Lang; Yau, Shueh-Lin |
| 國立成功大學 |
2012-10-09 |
Adsorption and Desorption of Bis-(3-sulfopropyl) Disulfide during Cu Electrodeposition and Stripping at Au Electrodes
|
Chiu, Yong-Da; Dow, Wei-Ping; Krug, Klaus; Liu, Yung-Fang; Lee, Yuh-Lang; Yau, Shueh-Lin |
| 國立成功大學 |
2012 |
In Situ STM Study of Cu Electrodeposition on TBPS-Modified Au(111) Electrodes
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Liu, Yung-Fang; Krug, Klaus; Lin, Pin-Chun; Chiu, Yong-Da; Dow, Wei-Ping; Yau, Shueh-Lin; Lee, Yuh-Lang |
| 國立成功大學 |
2011-04-21 |
Scanning Tunneling Microscopy and Cyclic Voltammetry Study of Self-Assembled 3,3 '-Thiobis(1-propanesulfonic acid, sodium salt) Monolayers on Au(111) Electrodes
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Liu, Yung-Fang; Krug, Klaus; Lin, Pin-Chun; Chiu, Yong-Da; Lee, Yuh-Lang; Dow, Wei-Ping |
| 國立成功大學 |
2011 |
Sensitivity Enhancement for Quantitative Electrochemical Determination of a Trace Amount of Accelerator in Copper Plating Solutions
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Chiu, Yong-Da; Dow, Wei-Ping; Huang, Su-Mei; Yau, Shueh-Lin; Lee, Yuh-Lang |
Showing items 1-5 of 5 (1 Page(s) Totally)
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