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Showing items 1-5 of 5 (1 Page(s) Totally)
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| 國立成功大學 |
2015-11-02 |
電気的接続構造と製造方法
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LLN, SHIH-KANG;CHO, CHENG-LIANG;YEH, CHE-YU;CHANG, HAO-MIAO;WANG, MEI-JUN |
| 國立成功大學 |
2015-07 |
Formation of Solid-Solution Cu-to-Cu Joints Using Ga Solder and Pt under Bump Metallurgy for Three-Dimensional Integrated Circuits
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Lin, Shih-kang; Chang, Hao-miao; Cho, Cheng-liang; Liu, Yu-chen; Kuo, Yi-kai |
| 國立成功大學 |
2014-01 |
Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples
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Lin, Shih-kang; Cho, Cheng-liang; Chang, Hao-miao |
| 國立成功大學 |
2013-07-29 |
銅/鎵界面反應及其在三維度積體電路的應用
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卓政樑; Cho, Cheng-Liang |
| 國立成功大學 |
2013-07-02 |
銅/鎵界面反應及其在三維度積體電路的應用
|
卓政樑; Cho, Cheng-Liang |
Showing items 1-5 of 5 (1 Page(s) Totally)
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