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Institution	Date	Title	Author
國立交通大學	2017-04-21T06:49:40Z	Electromigration in Pb-free solder bumps with Cu column as flip chip joints	Nah, Jae-Woong; Suh, J. O.; Tu, K. N.; Yoon, Seung Wook; Chong, Chai Tai; Kripesh, V.; Su, B. R.; Chen, Chih

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