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"chou chang pin"
Showing items 141-144 of 144 (6 Page(s) Totally)
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| 臺北醫學大學 |
2003 |
Effects of nitrogen plasma treatment on tantalum diffusion barriers in copper metallization
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Wu,Wen-Fa; Ou,Keng-Liang; Chou,Chang-Pin; Wu,Chi-Chang |
| 臺北醫學大學 |
2003 |
PECVD-Ti/TiNx barrier with multilayered amorphous structure and high thermal stability for copper metallization
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Wu,Wen-Fa; Ou,Keng-Liang; Chou,Chang-Pin; Hsua,Jwo-Lun |
| 臺北醫學大學 |
2002 |
Improved TaN Barrier Layer Against Cu Diffusion by Formation of an Amorphous Layer Using Plasma Treatment
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Ou,Keng-Liang; Wu,Wen-Fa; Chou,Chang-Pin; Chiou,Shi-Yung; Wu,Chi-Chang |
| 國立彰化師範大學 |
1995-06 |
Error induced by local yielding around hole in hole drilling method for measuring residual stress of materials
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Lin, Yi- Cheng; Chou, Chang-Pin |
Showing items 141-144 of 144 (6 Page(s) Totally)
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