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Institution Date Title Author
國立交通大學 2018-08-21T05:53:13Z Thermal performance evaluation of cascode Paralleled-GaN-HEMTs packaging for high power switching applications Chou, Hsin-Ping; Cheng, Stone
國立交通大學 2018-01-24T07:42:35Z 高功率氮化鎵元件之封裝與熱分析研究 周歆苹; 鄭泗東; Chou, Hsin-Ping; Cheng, Stone
國立交通大學 2016-03-28T00:04:06Z Development and characterization of the thermal behavior of packaged cascode GaN HEMTs Chou, Hsin-Ping; Cheng, Stone; Cheng, Chia-Hsiang; Chuang, Chia-Wei
國立交通大學 2014-12-08T15:34:47Z In Depth Thermal Analysis of Packaged GaN on Si Power Devices Wang, Chieh-An; Chou, Hsin-Ping; Cheng, Stone; Chou, Po-Chien
國立交通大學 2014-12-08T15:33:13Z Thermal Analysis and Electrical Performance of Packaged AlGaN/GaN Power HEMTs Chou, Po-Chien; Cheng, Stone; Chieng, Wei-Hua; Chang, E. Y.; Chou, Hsin-Ping

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