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"chou y f"的相关文件
显示项目 16-25 / 53 (共6页)
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| 臺大學術典藏 |
2020-03-09T09:11:25Z |
Registration of micro-computed tomography and histological images of the guinea pig cochlea to construct an ear model using an iterative closest point algorithm
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Lee C.-F.; Li G.-J.; Wan S.-Y.; Lee W.-J.; Tzen K.-Y.; Chen C.-H.; Song Y.-L.; Chou Y.-F.; Chen Y.-S.; TIEN-CHEN LIU |
| 臺大學術典藏 |
2020-03-09T09:11:21Z |
Modeling sound transmission of human middle ear and its clinical applications using finite element analysis
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Chen S.-I.; Lee M.-H.; Yao C.-M.; Chen P.-R.; Chou Y.-F.; TIEN-CHEN LIU; Song Y.-L.; Lee C.-F. |
| 臺大學術典藏 |
2020-03-09T09:11:21Z |
The development of a non-surgical direct drive hearing device with a wireless actuator coupled to the tympanic membrane
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Song Y.-L.; Jian J.-T.; Chen W.-Z.; Shih C.-H.; Chou Y.-F.; TIEN-CHEN LIU; Lee C.-F. |
| 臺大學術典藏 |
2020-02-11T02:34:29Z |
Building a network-aware and load-balanced structured peer-to-peer system for range query
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Joung, Y.-J;Chou, Y.-F.; Joung, Y.-J; Chou, Y.-F.; YUH-JZER JOUNG |
| 臺大學術典藏 |
2020-02-11T02:34:03Z |
Erratum: Building a network-aware and load-balanced peer-to-peer system for range queries (Computer Networks (2012) 56:8 (2148-2167))
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Joung, Y.-J;Wong, W.-T;Huang, H.-M;Chou, Y.-F.; Joung, Y.-J; Wong, W.-T; Huang, H.-M; Chou, Y.-F.; YUH-JZER JOUNG |
| 臺大學術典藏 |
2020-02-11T02:34:03Z |
Building a network-aware and load-balanced peer-to-peer system for range queries
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YUH-JZER JOUNG; Chou, Y.-F.; Huang, H.-M; Wong, W.-T; Joung, Y.-J; Joung, Y.-J;Wong, W.-T;Huang, H.-M;Chou, Y.-F. |
| 臺大學術典藏 |
2020-01-13T08:23:07Z |
Design and implementation of 3D-thermal test chip for exploration of package effects
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Chien, J.-H.; Lung, C.-L.; Lin, T.-W.; Tsai, K.-J.; Chen, T.-S.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN |
| 臺大學術典藏 |
2020-01-13T08:23:07Z |
Realization of virtual 126-core system with thermal sensor-network using metallic thermal skeletons
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Chien, J.-H.; Lung, C.-L.; Tsai, K.-J.; Hsu, C.-C.; Chen, T.-S.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN |
| 臺大學術典藏 |
2020-01-13T08:23:06Z |
Thermal stress aware design for stacking IC with through glass via
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Chien, J.-H.; Yu, H.; Lung, C.-L.; Chang, H.-C.; Tsai, N.-Y.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN |
| 臺大學術典藏 |
2020-01-13T08:23:06Z |
Hybrid thermal solution for 3D-ICs: Using thermal TSVs with placement algorithm for stress relieving structures
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Chien, J.-H.; Yu, H.; Tsai, N.-Y.; Lung, C.-L.; Hsu, C.-C.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN |
显示项目 16-25 / 53 (共6页)
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