English  |  正體中文  |  简体中文  |  Total items :0  
Visitors :  52633816    Online Users :  1020
Project Commissioned by the Ministry of Education
Project Executed by National Taiwan University Library
 
臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
About TAIR

Browse By

News

Copyright

Related Links

"chou y f"

Return to Browse by Author
Sorting by Title Sort by Date

Showing items 21-30 of 53  (6 Page(s) Totally)
<< < 1 2 3 4 5 6 > >>
View [10|25|50] records per page

Institution Date Title Author
臺大學術典藏 2020-02-11T02:34:03Z Building a network-aware and load-balanced peer-to-peer system for range queries YUH-JZER JOUNG; Chou, Y.-F.; Huang, H.-M; Wong, W.-T; Joung, Y.-J; Joung, Y.-J;Wong, W.-T;Huang, H.-M;Chou, Y.-F.
臺大學術典藏 2020-01-13T08:23:07Z Design and implementation of 3D-thermal test chip for exploration of package effects Chien, J.-H.; Lung, C.-L.; Lin, T.-W.; Tsai, K.-J.; Chen, T.-S.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN
臺大學術典藏 2020-01-13T08:23:07Z Realization of virtual 126-core system with thermal sensor-network using metallic thermal skeletons Chien, J.-H.; Lung, C.-L.; Tsai, K.-J.; Hsu, C.-C.; Chen, T.-S.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN
臺大學術典藏 2020-01-13T08:23:06Z Thermal stress aware design for stacking IC with through glass via Chien, J.-H.; Yu, H.; Lung, C.-L.; Chang, H.-C.; Tsai, N.-Y.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN
臺大學術典藏 2020-01-13T08:23:06Z Hybrid thermal solution for 3D-ICs: Using thermal TSVs with placement algorithm for stress relieving structures Chien, J.-H.; Yu, H.; Tsai, N.-Y.; Lung, C.-L.; Hsu, C.-C.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN
臺大學術典藏 2018-09-10T14:55:08Z Trajectory effect on the properties of large area ZnO thin films deposited by atmospheric pressure plasma jet JIA-YANG JUANG; Weng, C.-C.; Chou, Y.-F.; Lin, H.-T.; Chou, T.-S.; JIA-YANG JUANG;Weng, C.-C.;Chou, Y.-F.;Lin, H.-T.;Chou, T.-S.;Juang, J.-Y.;JIA-YANG JUANG; Juang, J.-Y.
臺大學術典藏 2018-09-10T09:18:50Z Hybrid thermal solution for 3D-ICs: Using thermal TSVs with placement algorithm for stress relieving structures Chien, J.-H.; Yu, H.; Tsai, N.-Y.; Lung, C.-L.; Hsu, C.-C.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN
臺大學術典藏 2018-09-10T08:37:34Z Realization of virtual 126-core system with thermal sensor-network using metallic thermal skeletons Chien, J.-H.; Lung, C.-L.; Tsai, K.-J.; Hsu, C.-C.; Chen, T.-S.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN
臺大學術典藏 2018-09-10T08:06:44Z Resonant frequency tunableness of solidly mounted resonators Liu, C.-H.; Chou, Y.-F.; CHIEN-HAO LIU
臺大學術典藏 2018-09-10T05:18:52Z Silicon-based high-frequency multiple-fourier horn ultrasonic nozzles for atomization and pumping JUNG-HO CHENG;Cheng, J.H.;Chou, Y.F.;Tsai, S.C.;Song, Y.L.;Tsai, C.S.;JUNG-HO CHENG; Tsai, C.S.; Song, Y.L.; Tsai, S.C.; Chou, Y.F.; Cheng, J.H.; JUNG-HO CHENG

Showing items 21-30 of 53  (6 Page(s) Totally)
<< < 1 2 3 4 5 6 > >>
View [10|25|50] records per page