| 國立臺灣科技大學 |
2010 |
CHARACTERIZATION OF ELECTRODEPOSITED INDIUM DOPED CdSe THIN FILMS
|
Mahalingam, T.;Mariappan, R.;Dhanasekaran, V.;Mohan, S.M.;Ravi, G.;Chu, J.P. |
| 國立臺灣科技大學 |
2010 |
Characterization of nanoindentation damage in metal/ceramic multilayered films by transmission electron microscopy (TEM)
|
Sun, P.L.;Chu, J.P.;Lin, T.Y.;Shen, Y.L.;Chawla, N. |
| 國立臺灣科技大學 |
2010 |
Indentation Behavior of Zr-Based Metallic-Glass Films via Molecular-Dynamics Simulations
|
Wang, Y.C.;Wu, C.Y.;Chu, J.P.;Liaw, P.K. |
| 國立臺灣大學 |
2010 |
Novel Cu-RuNx composite layer with good solderability and very low consumption rate
|
Chuang, H.Y.; Lin, C.H.; Chu, J.P.; Kao, C.R. |
| 國立臺灣科技大學 |
2009 |
Thermal stability study of Cu(MoN x ) seed layer on barrierless Si
|
Chu J.P.; Lin C.H.; Leau W.K.; John V.S. |
| 國立臺灣科技大學 |
2009 |
On the amorphous and nanocrystalline Zr-Cu and Zr-Ti co-sputtered thin films
|
Chen C.J.; Huang J.C.; Chou H.S.; Lai Y.H.; Chang L.W.; Du X.H.; Chu J.P.; Nieh T.G. |
| 國立臺灣科技大學 |
2009 |
Annealing-induced amorphization in a glass-forming thin film
|
Chu J.P. |
| 國立臺灣科技大學 |
2009 |
Study of the characteristics and corrosion behavior for the Zr-based metallic glass thin film fabricated by pulse magnetron sputtering process
|
Chu C.W.; Jang J.S.C.; Chiu S.M.; Chu J.P. |
| 國立臺灣科技大學 |
2009 |
Amorphous and nanocrystalline sputtered Mg-Cu thin films
|
Chou H.S.; Huang J.C.; Lai Y.H.; Chang L.W.; Du X.H.; Chu J.P.; Nieh T.G. |
| 國立臺灣科技大學 |
2009 |
Thermal Stability Study of Cu(MoNx) Seed Layer on Barrierless Si
|
Chu, J.P.;Lin, C.H.;Leau, W.K.;John, V.S. |
| 國立臺灣科技大學 |
2009 |
Cu(ReNx) for Advanced Barrierless Interconnects Stable Up To 730 degrees C
|
Chu, J.P.;Lin, C.H.;Sun, P.L.;Leau, W.K. |
| 國立臺灣科技大學 |
2009 |
Recent progress in metallic glasses in Taiwan
|
Huang, J.C.;Chu, J.P.;Jang, J.S.C. |
| 國立臺灣科技大學 |
2009 |
Electrical and Reliability Characteristics of Barrierless Cu-Based Contact for High Dielectric Constant Oxide Thin-Film Device Integration
|
Wu, C.H.;Chu, J.P.;Lin, C.H.;Wang, S.F. |
| 國立臺灣科技大學 |
2008 |
High performance Cu containing Ru or RuNX for barrierless metallization
|
Chu J.P.; Lin C.H. |
| 國立臺灣科技大學 |
2008 |
Novel CU alloy seed layers for barrierless metallization
|
Chu J.P.; Lin C.H. |
| 國立臺灣科技大學 |
2008 |
Interfacial reactions between Cu alloy and GaAs
|
Chu, J.P.;Leau, W.K.;Lin, C.H. |
| 國立臺灣科技大學 |
2008 |
Barrier-free Cu metallization with a novel copper seed layer containing various insoluble substances
|
Chu, J.P.;Lin, C.H.;John, V.S. |
| 國立臺灣科技大學 |
2008 |
Effects of post annealing on the material characteristics and electrical properties of La doped BaTiO3 sputtered films
|
Wu, C.H.;Chu, J.P.;Wang, S.F.;Lin, T.N.;Chang, W.Z.;John, V.S. |
| 國立臺灣科技大學 |
2008 |
Physical properties of strained Ba0.5 Sr0.5 (Ti,Mn) O3 thin films buffered with La0.68 Ba0.32 MnO3 conductive layers
|
Liang, Y.-C.;Liang, Y.-C.;Chu, J.P. |
| 國立臺灣科技大學 |
2008 |
Structures and properties of La- and Sm-doped BaTi O3 sputtered films: Post-annealing and dopant effects
|
Wu, C.H.;Chu, J.P.;Chang, W.Z.;John, V.S.;Wang, S.F.;Lin, C.H. |
| 國立臺灣科技大學 |
2008 |
Growth-temperature-dependent electrical properties of Mn doping Ba 0.5Sr0.5TiO3 thin films on la 0.72Ca0.28MnO3 electrodes
|
Liang, Y.-C.;Chu, J.P. |
| 國立臺灣科技大學 |
2007 |
Cu films containing insoluble Ru and Ru NX on barrierless Si for excellent property improvements
|
Chu, J.P.;Lin, C.H.;John, V.S. |
| 國立臺灣大學 |
2007 |
An experimental study on non-audit service and auditor decisions: Pre- and post-Procomp scandal
|
Duh, R.R.; Lee, W.C.; Lin, C.C.; Chu, J.P. |
| 臺大學術典藏 |
2007 |
An experimental study on non-audit service and auditor decisions: Pre- and post-Procomp scandal
|
Duh, R.R.; Lee, W.C.; Lin, C.C.; Chu, J.P.; Duh, R.R.; Lee, W.C.; Lin, C.C.; Chu, J.P. |
| 國立臺灣大學 |
2006 |
Productivity Growth in Public Accounting Industry: The Role of Information Technology and Human Capital
|
Duh, Rong-Ruey; Lee, W.C.; Lin, C. C.; Chu, J. P. |
