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Showing items 1-14 of 14 (1 Page(s) Totally)
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| 臺大學術典藏 |
2022-03-14T23:45:47Z |
Comparison of Various Solvent Extracts and Major Bioactive Components from Portulaca oleracea for Antioxidant, Anti-Tyrosinase, and Anti-α-Glucosidase Activities
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Chen, Wei Cheng; Wang, Shih Wei; Li, Cai Wei; Lin, Hsiang Ru; Yang, Chang Syun; Chu, Yi Cheng; TZONG-HUEI LEE; Chen, Jih Jung |
| 國立交通大學 |
2019-04-03T06:38:02Z |
Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu
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Liu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, King-Ning |
| 國立交通大學 |
2019-04-02T05:59:47Z |
Anisotropic grain growth to eliminate bonding interfaces in direct copper-tocopper joints using < 111> -oriented nanotwinned copper films
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Chu, Yi-Cheng; Chen, Chih |
| 國立交通大學 |
2019-04-02T05:58:38Z |
Communication-Growth of <111> Nanotwinned Nickel Films on <111> Nanotwinned Cu Substrates
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Chu, Yi-Cheng; Chen, Chih |
| 國立交通大學 |
2018-08-21T05:56:49Z |
Low temperature Cu-Cu direct bonding by (111) oriented nano-twin Cu
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Juang, Jing-Ye; Chu, Yi-Cheng; Lu, Chia-Ling; Chen, Chih; Tu, King-Ning |
| 國立交通大學 |
2018-08-21T05:54:31Z |
Effect of Sn grain orientation and strain distribution in 20-mu m-diameter microbumps on crack formation under thermal cycling tests
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Chu, Yi-Cheng; Chen, Chih; Kao, Nicholas; Jiang, Don Son |
| 國立交通大學 |
2018-08-21T05:53:03Z |
Growth competition between layer-type and porous-type Cu3Sn in microbumps
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Chu, David T.; Chu, Yi-Cheng; Lin, Jie-An; Chen, Yi-Ting; Wang, Chun-Chieh; Song, Yen-Fang; Chiang, Cheng-Cheng; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:49:38Z |
LOW-TEMPERATURE AND LOW-PRESSURE DIRECT COPPER-TO-COPPER BONDING BY HIGHLY (111)-ORIENTED NANOTWINNED CU
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Chen, Chih; Liu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:49:07Z |
Electromigration in microbumps with Cu-Sn intermetallic compounds
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Chu, Yi-Cheng; Zhan, Chau-Jie; Lin, Han-Wen; Huang, Yu-Wei; Chen, Chih |
| 國立交通大學 |
2017-04-21T06:48:31Z |
Low-temperature and low pressure copper-to-copper direct bonding enabled by creep on highly (111)-oriented Cu surfaces
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Tseng, Chih-Han; Liu, Chien-Min; Lin, Han-wen; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:48:21Z |
Fabrication of (111) nanotwinned Cu and its applications in interconnects of microelectronic devices
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Chen, Chih; Liu, Chien-Min; Lu, Tien-Lin; Lin, Han-wen; Chu, Yi-Cheng; Lu, Chia-Ling; Juang, Jing-Ye; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:35:49Z |
Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces
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Liu, Chien-Min; Lin, Han-Wen; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N. |
| 淡江大學 |
2012 |
MOBILE01和PTT兩個不同論壇相同面向習慣用詞之探討 : 以電信, 寬頻版為例
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瞿怡正; Chu, Yi-Cheng |
| 國立臺灣大學 |
2011 |
轉爐石?燒/碳酸化循環捕捉二氧化碳之研究
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朱怡誠; Chu, Yi-Cheng |
Showing items 1-14 of 14 (1 Page(s) Totally)
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