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Showing items 36-45 of 56  (6 Page(s) Totally)
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Institution Date Title Author
國立交通大學 2014-12-08T15:27:11Z A study on electrochemical metrologies for evaluating the removal selectivity of AlCMP Chiu, SY; Hsu, JW; Tung, IC; Shih, HC; Feng, MS; Tsai, MS; Dai, BT
國立交通大學 2014-12-08T15:27:08Z Evaluation of impurity migration and microwave digestion methods for lithographic materials Ko, FH; Hsiao, LT; Chou, CT; Wang, MY; Wang, TK; Sun, YC; Cheng, BJ; Yeng, S; Dai, BT
國立交通大學 2014-12-08T15:27:05Z Study on chemical-mechanical polishing of low dielectric constant polyimide thin films Tai, YL; Tsai, MS; Tung, IC; Dai, BT; Feng, MS
國立交通大學 2014-12-08T15:26:56Z Film characterization and evaluation of process performance for the modified electron beam resist Ko, FH; Ting, JH; Chou, CT; Hsiao, LT; Huang, TY; Dai, BT
國立交通大學 2014-12-08T15:26:56Z Technology of electroplating copper with low-K material a-C : F for 0.15 mu m damascene interconnection Shieh, JM; Suen, SC; Lin, KC; Chang, SC; Dai, BT; Chen, CF; Feng, MS
國立交通大學 2014-12-08T15:17:43Z Effect of surface passivation removal on planarization efficiency in Cu abrasive-free polishing Fang, JY; Tsai, MS; Dai, BT; Wu, YS; Feng, MS
國立交通大學 2014-12-08T15:17:35Z Study on pressure-independent Cu removal in Cu abrasive-free polishing Fang, JY; Huang, PW; Tsai, MS; Dai, BT; Wu, YS; Feng, MS
國立交通大學 2014-12-08T15:17:03Z Dopant profile engineering by near-infrared femtosecond laser activation Wang, YC; Pan, CL; Shieh, JM; Dai, BT
國立交通大學 2014-12-08T15:16:39Z Aging influence of poly(ethylene glycol) suppressors of Cu electrolytes on gaps filling Liu, SH; Li, TC; Chen, C; Shieh, JM; Dai, BT; Hensen, K; Cheng, SS
國立交通大學 2014-12-08T15:03:25Z IMPROVEMENT OF THIN OXIDES THERMALLY GROWN ON THE REACTIVE-ION-ETCHED SILICON SUBSTRATES UENG, SY; WANG, PW; KANG, TK; CHAO, TS; CHEN, WH; DAI, BT; CHENG, HC

Showing items 36-45 of 56  (6 Page(s) Totally)
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