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Showing items 26-50 of 56  (3 Page(s) Totally)
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Institution Date Title Author
國立交通大學 2014-12-08T15:40:06Z The application of electrochemical metrologies for investigating chemical mechanical polishing of Al with a Ti barrier layer Chiu, SY; Wang, YL; Liu, CP; Lan, JK; Ay, C; Feng, MS; Tsai, MS; Dai, BT
國立交通大學 2014-12-08T15:39:57Z Roles of copper mechanical characteristics in electropolishing Chang, SC; Shieh, JM; Fang, JY; Wang, YL; Dai, BT; Feng, MS
國立交通大學 2014-12-08T15:39:46Z Stable blue luminescence from mesoporous silica films Shieh, JM; Cho, AT; Lai, YF; Dai, BT; Pan, FM; Chao, KJ
國立交通大學 2014-12-08T15:39:45Z Synthesis of microcrystalline silicon at room temperature using ICP Wu, JH; Shieh, JM; Dai, BT; Wu, YCS
國立交通大學 2014-12-08T15:39:17Z The removal of airborne molecular contamination in cleanroom using PTFE and chemical filters Yeh, CF; Hsiao, CW; Lin, SJ; Hsieh, CM; Kusumi, T; Aomi, H; Kaneko, H; Dai, BT; Tsai, MS
國立交通大學 2014-12-08T15:38:41Z Near-infrared femtosecond laser-induced crystallization of amorphous silicon Shieh, JM; Chen, ZH; Dai, BT; Wang, YC; Zaitsev, A; Pan, CL
國立交通大學 2014-12-08T15:37:19Z Post-Cu CMP cleaning for colloidal silica abrasive removal Chen, PL; Chen, JH; Tsai, MS; Dai, BT; Yeh, CF
國立交通大學 2014-12-08T15:36:01Z Pattern effect optimized with non-native surface passivation in copper abrasive-free polishing Fang, JY; Tsai, MS; Dai, BT; Wu, YS; Feng, MS
國立交通大學 2014-12-08T15:36:01Z Emission of bright blue light from mesoporous silica with dense Si (Ge) nanocrystals Cho, AT; Shieh, JM; Shieh, J; Lai, YF; Dai, BT; Pan, FM; Kuo, HC; Lin, YC; Chao, KJ; Liu, PH
國立交通大學 2014-12-08T15:36:00Z Two-additive electrolytes for superplanarizing damascene Cu metals Liu, SH; Shieh, JM; Chen, C; Dai, BT; Hensen, K; Cheng, SS
國立交通大學 2014-12-08T15:27:11Z A study on electrochemical metrologies for evaluating the removal selectivity of AlCMP Chiu, SY; Hsu, JW; Tung, IC; Shih, HC; Feng, MS; Tsai, MS; Dai, BT
國立交通大學 2014-12-08T15:27:08Z Evaluation of impurity migration and microwave digestion methods for lithographic materials Ko, FH; Hsiao, LT; Chou, CT; Wang, MY; Wang, TK; Sun, YC; Cheng, BJ; Yeng, S; Dai, BT
國立交通大學 2014-12-08T15:27:05Z Study on chemical-mechanical polishing of low dielectric constant polyimide thin films Tai, YL; Tsai, MS; Tung, IC; Dai, BT; Feng, MS
國立交通大學 2014-12-08T15:26:56Z Film characterization and evaluation of process performance for the modified electron beam resist Ko, FH; Ting, JH; Chou, CT; Hsiao, LT; Huang, TY; Dai, BT
國立交通大學 2014-12-08T15:26:56Z Technology of electroplating copper with low-K material a-C : F for 0.15 mu m damascene interconnection Shieh, JM; Suen, SC; Lin, KC; Chang, SC; Dai, BT; Chen, CF; Feng, MS
國立交通大學 2014-12-08T15:17:43Z Effect of surface passivation removal on planarization efficiency in Cu abrasive-free polishing Fang, JY; Tsai, MS; Dai, BT; Wu, YS; Feng, MS
國立交通大學 2014-12-08T15:17:35Z Study on pressure-independent Cu removal in Cu abrasive-free polishing Fang, JY; Huang, PW; Tsai, MS; Dai, BT; Wu, YS; Feng, MS
國立交通大學 2014-12-08T15:17:03Z Dopant profile engineering by near-infrared femtosecond laser activation Wang, YC; Pan, CL; Shieh, JM; Dai, BT
國立交通大學 2014-12-08T15:16:39Z Aging influence of poly(ethylene glycol) suppressors of Cu electrolytes on gaps filling Liu, SH; Li, TC; Chen, C; Shieh, JM; Dai, BT; Hensen, K; Cheng, SS
國立交通大學 2014-12-08T15:03:25Z IMPROVEMENT OF THIN OXIDES THERMALLY GROWN ON THE REACTIVE-ION-ETCHED SILICON SUBSTRATES UENG, SY; WANG, PW; KANG, TK; CHAO, TS; CHEN, WH; DAI, BT; CHENG, HC
國立交通大學 2014-12-08T15:03:25Z EFFECTS OF POLYSILICON ELECTRON-CYCLOTRON-RESONANCE ETCHING ON ELECTRICAL CHARACTERISTICS OF GATE OXIDES KANG, TK; UENG, SY; DAI, BT; CHEN, LP; CHENG, HC
國立交通大學 2014-12-08T15:03:11Z CHARACTERIZATION OF THE CHEMICAL-MECHANICAL POLISHING PROCESS-BASED ON NANOINDENTATION MEASUREMENT OF DIELECTRIC FILMS LIU, CW; DAI, BT; YEH, CF
國立交通大學 2014-12-08T15:03:02Z Chemical mechanical polishing of PSG and BPSG dielectric films: The effect of phosphorus and boron concentration Liu, CW; Dai, BT; Yeh, CF
國立交通大學 2014-12-08T15:02:53Z Antenna charging effects on the electrical characteristics of polysilicon gate during electron cyclotron resonance etching Kang, TK; Ueng, SY; Dai, BT; Chen, LP; Cheng, HC
國立交通大學 2014-12-08T15:02:52Z Modeling of the wear mechanism during chemical-mechanical polishing Liu, CW; Dai, BT; Tseng, WT; Yeh, CF

Showing items 26-50 of 56  (3 Page(s) Totally)
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