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Showing items 31-40 of 56  (6 Page(s) Totally)
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Institution Date Title Author
國立交通大學 2014-12-08T15:38:41Z Near-infrared femtosecond laser-induced crystallization of amorphous silicon Shieh, JM; Chen, ZH; Dai, BT; Wang, YC; Zaitsev, A; Pan, CL
國立交通大學 2014-12-08T15:37:19Z Post-Cu CMP cleaning for colloidal silica abrasive removal Chen, PL; Chen, JH; Tsai, MS; Dai, BT; Yeh, CF
國立交通大學 2014-12-08T15:36:01Z Pattern effect optimized with non-native surface passivation in copper abrasive-free polishing Fang, JY; Tsai, MS; Dai, BT; Wu, YS; Feng, MS
國立交通大學 2014-12-08T15:36:01Z Emission of bright blue light from mesoporous silica with dense Si (Ge) nanocrystals Cho, AT; Shieh, JM; Shieh, J; Lai, YF; Dai, BT; Pan, FM; Kuo, HC; Lin, YC; Chao, KJ; Liu, PH
國立交通大學 2014-12-08T15:36:00Z Two-additive electrolytes for superplanarizing damascene Cu metals Liu, SH; Shieh, JM; Chen, C; Dai, BT; Hensen, K; Cheng, SS
國立交通大學 2014-12-08T15:27:11Z A study on electrochemical metrologies for evaluating the removal selectivity of AlCMP Chiu, SY; Hsu, JW; Tung, IC; Shih, HC; Feng, MS; Tsai, MS; Dai, BT
國立交通大學 2014-12-08T15:27:08Z Evaluation of impurity migration and microwave digestion methods for lithographic materials Ko, FH; Hsiao, LT; Chou, CT; Wang, MY; Wang, TK; Sun, YC; Cheng, BJ; Yeng, S; Dai, BT
國立交通大學 2014-12-08T15:27:05Z Study on chemical-mechanical polishing of low dielectric constant polyimide thin films Tai, YL; Tsai, MS; Tung, IC; Dai, BT; Feng, MS
國立交通大學 2014-12-08T15:26:56Z Film characterization and evaluation of process performance for the modified electron beam resist Ko, FH; Ting, JH; Chou, CT; Hsiao, LT; Huang, TY; Dai, BT
國立交通大學 2014-12-08T15:26:56Z Technology of electroplating copper with low-K material a-C : F for 0.15 mu m damascene interconnection Shieh, JM; Suen, SC; Lin, KC; Chang, SC; Dai, BT; Chen, CF; Feng, MS

Showing items 31-40 of 56  (6 Page(s) Totally)
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