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| 國立交通大學 |
2018-08-21T05:52:50Z |
Investigation of Co Thin Film as Buffer Layer Applied to Cu/Sn Eutectic Bonding and UBM With Sn, SnCu, and SAC Solders Joints
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Tang, Ya-Sheng; Derakhshandeh, Jaber; Kho, Yi-Tung; Chang, Yao-Jen; Slabbekoorn, John; De Preter, Inge; Vanstreels, Kris; Rebibis, Kenneth June; Beyne, Eric; Chen, Kuan-Neng |
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