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Showing items 1-3 of 3 (1 Page(s) Totally)
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| 國立交通大學 |
2020-03-09 |
Polydopamine and Its Composite Film as an Adhesion Layer for Cu Electroless Deposition on SiO2
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Wu, Pu-Wei; Koike, Junichi; Dordi, Yezdi; Chung, Wei-An; Fan, Tzu-Ling; Chou, Shih-Cheng |
| 國立交通大學 |
2019-10-05T00:08:44Z |
Interface Engineering Strategy Utilizing Electrochemical ALD of Cu-Zn for Enabling Metallization of Sub-10 nm Semiconductor Device Nodes
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Joi, Aniruddha; Venkatraman, Kailash; Tso, Kuang-Chih; Dictus, Dries; Dordi, Yezdi; Wu, Pu-Wei; Pao, Chih-Wen; Akolkar, Rohan |
| 國立交通大學 |
2018-08-21T05:53:26Z |
Pulse electrodeposition of copper-manganese alloy in deep eutectic solvent
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Chiang, Wei-Shen; Huang, Jun-Qian; Chen, Po-Chun; Wu, Pu-Wei; Joi, Aniruddha; Dordi, Yezdi |
Showing items 1-3 of 3 (1 Page(s) Totally)
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