臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
臺大學術典藏	2020-02-03T08:43:21Z	Modeling noise coupling between package and PCB power/ground planes with an efficient 2-D FDTD/lumped element method	Wang, Ting-Kuang; Chen, Sin-Ting; Tsai, Chi-Wei; Wu, Sung-Mao; Drewniak, James L.; Wu, Tzong-Lin; CHI-WEI TSAI

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