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"duh jg"的相关文件
显示项目 1-10 / 43 (共5页)
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| 國立交通大學 |
2014-12-08T15:45:14Z |
The effect of substrate surface roughness on the wettability of Sn-Bi solders
|
Chen, YY; Duh, JG; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:44:43Z |
Thermal cycling test in Sn-Bi and Sn-Bi-Cu solder joints
|
Miao, HW; Duh, JG; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:44:11Z |
The influence of washing and calcination condition on urea-derived ceria-yttria-doped tetragonal zirconia powders
|
Lin, JD; Duh, JG; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:43:53Z |
Wettability of electroless Ni in the under bump metallurgy with lead free solder
|
Young, BL; Duh, JG; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:43:38Z |
Luminescent mechanisms of ZnS : Cu : Cl and ZnS : Cu : Al phosphors
|
Chen, YY; Duh, JG; Chiou, BS; Peng, CG |
| 國立交通大學 |
2014-12-08T15:43:31Z |
Synthesis of Eu3+-activated yttrium oxysulfide red phosphor by flux fusion method
|
Lo, CL; Duh, JG; Chiou, BS; Peng, CC; Ozawa, L |
| 國立交通大學 |
2014-12-08T15:42:16Z |
Low-voltage cathodoluminescence properties of the Y2O2S : Eu red light emitting phosphor screen in field-emission environments
|
Lo, CL; Duh, JG; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:41:51Z |
Microstructure characteristics for anorthite composite glass with nucleating agents of TiO2 under non-isothermal crystallization
|
Lo, CL; Duh, JG; Chiou, BS; Lee, WH |
| 國立交通大學 |
2014-12-08T15:41:20Z |
Effects of Ni thickness and reflow times on interfacial reactions between Ni/Cu under-bump metallization and eutectic Sn-Pb solder in flip-chip technology
|
Huang, CS; Duh, JG; Chen, YM; Wang, JH |
| 國立交通大學 |
2014-12-08T15:41:18Z |
Low temperature sintering and crystallisation behaviour of low loss anorthite-based glass-ceramics
|
Lo, CL; Duh, JG; Chiou, BS |
显示项目 1-10 / 43 (共5页)
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