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"duh jg"
Showing items 11-20 of 43 (5 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:40:03Z |
Metallurgical reaction of the Sn-3.5Ag solder and Sn-37Pb solder with Ni/Cu under-bump metallization in a flip-chip package
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Huang, CS; Duh, JG; Chen, YM |
| 國立交通大學 |
2014-12-08T15:17:40Z |
Wettability of electroplated Ni-P in under bump metallurgy with Sn-Ag-Cu solder
|
Lin, YC; Duh, JG; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:06:09Z |
DEHYDRATION OF SYNTHESIZED CALCIA-STABILIZED ZIRCONIA FROM A COPRECIPITATION PROCESS
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CHIOU, BS; HSU, WY; DUH, JG |
| 國立交通大學 |
2014-12-08T15:06:04Z |
MICROSTRUCTURE AND PROPERTIES OF MULTILAYER-DERIVED TUNGSTEN SILICIDE
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CHIOU, BS; RAU, HL; CHANG, PH; DUH, JG |
| 國立交通大學 |
2014-12-08T15:06:02Z |
THE INFLUENCE OF FIRING PROFILE AND ADDITIVES ON THE PTCR EFFECT AND MICROSTRUCTURE OF BATIO3 CERAMICS
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CHIOU, BS; KOH, CM; DUH, JG |
| 國立交通大學 |
2014-12-08T15:05:57Z |
THERMAL EVOLUTION IN SYNTHESIZED ZNO VARISTORS BY THE UREA PROCESS
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CHIOU, BS; TSAI, YJ; DUH, JG |
| 國立交通大學 |
2014-12-08T15:05:56Z |
THE EFFECT OF SINTERING CONDITIONS ON THE GRAIN-GROWTH OF THE BATIO3-BASED GBBL CAPACITORS
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CHIOU, BS; LIN, ST; DUH, JG |
| 國立交通大學 |
2014-12-08T15:05:56Z |
CHARACTERISTICS OF PD-DOPED TIN OXIDE CERAMICS IN RESPONSE TO CO GAS
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CHIOU, BS; LI, JJ; DUH, JG |
| 國立交通大學 |
2014-12-08T15:05:56Z |
SINTERING, MICROSTRUCTURE, HARDNESS, AND FRACTURE-TOUGHNESS BEHAVIOR OF Y2O3-CEO2-ZRO2
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DUH, JG; DAI, HT; CHIOU, BS |
| 國立交通大學 |
2014-12-08T15:05:52Z |
INTERFACIAL MORPHOLOGY AND PRE-OXIDATION EFFECT IN DENTAL ALLOY OPAQUE BONDING
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DUH, JG; CHIEN, WS; CHIOU, BS |
Showing items 11-20 of 43 (5 Page(s) Totally)
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