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Showing items 11-35 of 43  (2 Page(s) Totally)
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Institution Date Title Author
國立交通大學 2014-12-08T15:40:03Z Metallurgical reaction of the Sn-3.5Ag solder and Sn-37Pb solder with Ni/Cu under-bump metallization in a flip-chip package Huang, CS; Duh, JG; Chen, YM
國立交通大學 2014-12-08T15:17:40Z Wettability of electroplated Ni-P in under bump metallurgy with Sn-Ag-Cu solder Lin, YC; Duh, JG; Chiou, BS
國立交通大學 2014-12-08T15:06:09Z DEHYDRATION OF SYNTHESIZED CALCIA-STABILIZED ZIRCONIA FROM A COPRECIPITATION PROCESS CHIOU, BS; HSU, WY; DUH, JG
國立交通大學 2014-12-08T15:06:04Z MICROSTRUCTURE AND PROPERTIES OF MULTILAYER-DERIVED TUNGSTEN SILICIDE CHIOU, BS; RAU, HL; CHANG, PH; DUH, JG
國立交通大學 2014-12-08T15:06:02Z THE INFLUENCE OF FIRING PROFILE AND ADDITIVES ON THE PTCR EFFECT AND MICROSTRUCTURE OF BATIO3 CERAMICS CHIOU, BS; KOH, CM; DUH, JG
國立交通大學 2014-12-08T15:05:57Z THERMAL EVOLUTION IN SYNTHESIZED ZNO VARISTORS BY THE UREA PROCESS CHIOU, BS; TSAI, YJ; DUH, JG
國立交通大學 2014-12-08T15:05:56Z THE EFFECT OF SINTERING CONDITIONS ON THE GRAIN-GROWTH OF THE BATIO3-BASED GBBL CAPACITORS CHIOU, BS; LIN, ST; DUH, JG
國立交通大學 2014-12-08T15:05:56Z CHARACTERISTICS OF PD-DOPED TIN OXIDE CERAMICS IN RESPONSE TO CO GAS CHIOU, BS; LI, JJ; DUH, JG
國立交通大學 2014-12-08T15:05:56Z SINTERING, MICROSTRUCTURE, HARDNESS, AND FRACTURE-TOUGHNESS BEHAVIOR OF Y2O3-CEO2-ZRO2 DUH, JG; DAI, HT; CHIOU, BS
國立交通大學 2014-12-08T15:05:52Z INTERFACIAL MORPHOLOGY AND PRE-OXIDATION EFFECT IN DENTAL ALLOY OPAQUE BONDING DUH, JG; CHIEN, WS; CHIOU, BS
國立交通大學 2014-12-08T15:05:51Z WETTABILITY IN ZRO2-NI AND ZRO2-CU BONDING DUH, JG; CHIEN, WS; CHIOU, BS
國立交通大學 2014-12-08T15:05:48Z A ZNO VARISTOR DERIVED FROM METAL-OXIDE DIFFUSION CHIOU, BS; CHEN, TC; DUH, JG
國立交通大學 2014-12-08T15:05:46Z CATALYTIC AND GAS SENSING CHARACTERISTICS IN PD-DOPED SNO2 DUH, JG; JOU, JW; CHIOU, BS
國立交通大學 2014-12-08T15:05:45Z EQUIVALENT-CIRCUIT MODEL IN GRAIN-BOUNDARY BARRIER LAYER CAPACITORS CHIOU, BS; LIN, ST; DUH, JG; CHANG, PH
國立交通大學 2014-12-08T15:05:42Z EPR EVIDENCE FOR COMPENSATING DEFECTS IN BATIO3 GRAIN-BOUNDARY BARRIER LAYER CAPACITORS CHIOU, BS; LIN, ST; DUH, JG
國立交通大學 2014-12-08T15:05:39Z FABRICATION AND ELECTRICAL BEHAVIOR OF SOL-PRECIPITATE LINBO3 CERAMICS WITH THE ADDITION OF (LIF + MGF2) CHIOU, BS; LIN, TY; DUH, JG
國立交通大學 2014-12-08T15:05:38Z THERMAL CHARACTERIZATION OF SYNTHESIZED Y2O3-CEO2-ZRO2 DUH, JG; LEE, MY; CHIOU, BS
國立交通大學 2014-12-08T15:05:36Z ELECTRICAL BEHAVIOR OF CERIA-STABILIZED ZIRCONIA WITH RARE-EARTH-OXIDE ADDITIVES CHIOU, BS; DAI, HT; DUH, JG
國立交通大學 2014-12-08T15:05:35Z MORPHOLOGY, STRENGTH AND PRE-COATING EFFECT IN YSZ/NI BONDING DUH, JG; WU, YC; CHIOU, BS
國立交通大學 2014-12-08T15:05:34Z INTERMETALLIC FORMATION ON THE FRACTURE OF SN/PB SOLDER AND PD/AG CONDUCTOR INTERFACES CHIOU, BS; LIU, KC; DUH, JG; PALANISAMY, PS
國立交通大學 2014-12-08T15:05:31Z RUTHERFORD BACKSCATTERING SPECTROSCOPY ANALYSIS OF AR+ IMPLANTED YTTRIA STABILIZED ZIRCONIA DUH, JG; WU, YS; CHOUI, BS
國立交通大學 2014-12-08T15:05:19Z TEMPERATURE CYCLING EFFECTS BETWEEN SN/PB SOLDER AND THICK-FILM PD/AG CONDUCTOR METALLIZATION CHIOU, BS; LIU, KC; DUH, JG; PALANISAMY, PS
國立交通大學 2014-12-08T15:05:15Z SINTERING BEHAVIOR AND DIELECTRIC CHARACTERISTICS OF LITAO3 WITH THE ADDITION OF (MG2+TIO2) CHIOU, BS; LIN, TY; DUH, JG
國立交通大學 2014-12-08T15:05:10Z DEVELOPMENT OF TEMPERATURE-STABLE THICK-FILM DIELECTRICS .3. ROLE OF GLASS ON THE MICROSTRUCTURE EVOLUTION OF A THICK-FILM DIELECTRIC CHIOU, BS; LIU, KC; DUH, JG; CHUNG, MC
國立交通大學 2014-12-08T15:04:53Z THE EFFECT OF APPLIED FREQUENCIES AND MULTIPLE FIRING ON THE RESISTANCE OF THICK-FILM RESISTORS CHIOU, BS; HSU, WY; DUH, JG

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