| 國立交通大學 |
2014-12-08T15:40:03Z |
Metallurgical reaction of the Sn-3.5Ag solder and Sn-37Pb solder with Ni/Cu under-bump metallization in a flip-chip package
|
Huang, CS; Duh, JG; Chen, YM |
| 國立交通大學 |
2014-12-08T15:17:40Z |
Wettability of electroplated Ni-P in under bump metallurgy with Sn-Ag-Cu solder
|
Lin, YC; Duh, JG; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:06:09Z |
DEHYDRATION OF SYNTHESIZED CALCIA-STABILIZED ZIRCONIA FROM A COPRECIPITATION PROCESS
|
CHIOU, BS; HSU, WY; DUH, JG |
| 國立交通大學 |
2014-12-08T15:06:04Z |
MICROSTRUCTURE AND PROPERTIES OF MULTILAYER-DERIVED TUNGSTEN SILICIDE
|
CHIOU, BS; RAU, HL; CHANG, PH; DUH, JG |
| 國立交通大學 |
2014-12-08T15:06:02Z |
THE INFLUENCE OF FIRING PROFILE AND ADDITIVES ON THE PTCR EFFECT AND MICROSTRUCTURE OF BATIO3 CERAMICS
|
CHIOU, BS; KOH, CM; DUH, JG |
| 國立交通大學 |
2014-12-08T15:05:57Z |
THERMAL EVOLUTION IN SYNTHESIZED ZNO VARISTORS BY THE UREA PROCESS
|
CHIOU, BS; TSAI, YJ; DUH, JG |
| 國立交通大學 |
2014-12-08T15:05:56Z |
THE EFFECT OF SINTERING CONDITIONS ON THE GRAIN-GROWTH OF THE BATIO3-BASED GBBL CAPACITORS
|
CHIOU, BS; LIN, ST; DUH, JG |
| 國立交通大學 |
2014-12-08T15:05:56Z |
CHARACTERISTICS OF PD-DOPED TIN OXIDE CERAMICS IN RESPONSE TO CO GAS
|
CHIOU, BS; LI, JJ; DUH, JG |
| 國立交通大學 |
2014-12-08T15:05:56Z |
SINTERING, MICROSTRUCTURE, HARDNESS, AND FRACTURE-TOUGHNESS BEHAVIOR OF Y2O3-CEO2-ZRO2
|
DUH, JG; DAI, HT; CHIOU, BS |
| 國立交通大學 |
2014-12-08T15:05:52Z |
INTERFACIAL MORPHOLOGY AND PRE-OXIDATION EFFECT IN DENTAL ALLOY OPAQUE BONDING
|
DUH, JG; CHIEN, WS; CHIOU, BS |
| 國立交通大學 |
2014-12-08T15:05:51Z |
WETTABILITY IN ZRO2-NI AND ZRO2-CU BONDING
|
DUH, JG; CHIEN, WS; CHIOU, BS |
| 國立交通大學 |
2014-12-08T15:05:48Z |
A ZNO VARISTOR DERIVED FROM METAL-OXIDE DIFFUSION
|
CHIOU, BS; CHEN, TC; DUH, JG |
| 國立交通大學 |
2014-12-08T15:05:46Z |
CATALYTIC AND GAS SENSING CHARACTERISTICS IN PD-DOPED SNO2
|
DUH, JG; JOU, JW; CHIOU, BS |
| 國立交通大學 |
2014-12-08T15:05:45Z |
EQUIVALENT-CIRCUIT MODEL IN GRAIN-BOUNDARY BARRIER LAYER CAPACITORS
|
CHIOU, BS; LIN, ST; DUH, JG; CHANG, PH |
| 國立交通大學 |
2014-12-08T15:05:42Z |
EPR EVIDENCE FOR COMPENSATING DEFECTS IN BATIO3 GRAIN-BOUNDARY BARRIER LAYER CAPACITORS
|
CHIOU, BS; LIN, ST; DUH, JG |
| 國立交通大學 |
2014-12-08T15:05:39Z |
FABRICATION AND ELECTRICAL BEHAVIOR OF SOL-PRECIPITATE LINBO3 CERAMICS WITH THE ADDITION OF (LIF + MGF2)
|
CHIOU, BS; LIN, TY; DUH, JG |
| 國立交通大學 |
2014-12-08T15:05:38Z |
THERMAL CHARACTERIZATION OF SYNTHESIZED Y2O3-CEO2-ZRO2
|
DUH, JG; LEE, MY; CHIOU, BS |
| 國立交通大學 |
2014-12-08T15:05:36Z |
ELECTRICAL BEHAVIOR OF CERIA-STABILIZED ZIRCONIA WITH RARE-EARTH-OXIDE ADDITIVES
|
CHIOU, BS; DAI, HT; DUH, JG |
| 國立交通大學 |
2014-12-08T15:05:35Z |
MORPHOLOGY, STRENGTH AND PRE-COATING EFFECT IN YSZ/NI BONDING
|
DUH, JG; WU, YC; CHIOU, BS |
| 國立交通大學 |
2014-12-08T15:05:34Z |
INTERMETALLIC FORMATION ON THE FRACTURE OF SN/PB SOLDER AND PD/AG CONDUCTOR INTERFACES
|
CHIOU, BS; LIU, KC; DUH, JG; PALANISAMY, PS |
| 國立交通大學 |
2014-12-08T15:05:31Z |
RUTHERFORD BACKSCATTERING SPECTROSCOPY ANALYSIS OF AR+ IMPLANTED YTTRIA STABILIZED ZIRCONIA
|
DUH, JG; WU, YS; CHOUI, BS |
| 國立交通大學 |
2014-12-08T15:05:19Z |
TEMPERATURE CYCLING EFFECTS BETWEEN SN/PB SOLDER AND THICK-FILM PD/AG CONDUCTOR METALLIZATION
|
CHIOU, BS; LIU, KC; DUH, JG; PALANISAMY, PS |
| 國立交通大學 |
2014-12-08T15:05:15Z |
SINTERING BEHAVIOR AND DIELECTRIC CHARACTERISTICS OF LITAO3 WITH THE ADDITION OF (MG2+TIO2)
|
CHIOU, BS; LIN, TY; DUH, JG |
| 國立交通大學 |
2014-12-08T15:05:10Z |
DEVELOPMENT OF TEMPERATURE-STABLE THICK-FILM DIELECTRICS .3. ROLE OF GLASS ON THE MICROSTRUCTURE EVOLUTION OF A THICK-FILM DIELECTRIC
|
CHIOU, BS; LIU, KC; DUH, JG; CHUNG, MC |
| 國立交通大學 |
2014-12-08T15:04:53Z |
THE EFFECT OF APPLIED FREQUENCIES AND MULTIPLE FIRING ON THE RESISTANCE OF THICK-FILM RESISTORS
|
CHIOU, BS; HSU, WY; DUH, JG |
