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"duh jg"
Showing items 36-43 of 43 (2 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:04:52Z |
A SALT SPRAY TEST ON INTERLAYER-MODIFIED TIN COATING
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CHEN, YI; DUH, JG; CHIOU, BS; YANG, TJ |
| 國立交通大學 |
2014-12-08T15:04:31Z |
METALLIZATION OF ALUMINUM NITRIDE SUBSTRATES BY ELECTROLESS COPPER PLATING
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CHIOU, BS; CHANG, JH; DUH, JG |
| 國立交通大學 |
2014-12-08T15:04:21Z |
CORROSION BEHAVIOR OF ELECTROLESS NICKEL-PLATING MODIFIED TIN COATING
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DOONG, JC; DUH, JG; TSAI, SY; WANG, JH; CHIOU, BS |
| 國立交通大學 |
2014-12-08T15:04:16Z |
MORPHOLOGY AND ADHESION STRENGTH IN ELECTROLESS CU METALLIZED ALN SUBSTRATE
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CHANG, JH; DUH, JG; CHIOU, BS |
| 國立交通大學 |
2014-12-08T15:04:15Z |
FABRICATION AND PROPERTIES OF ALUMINO-BORO-SILICATE GLASS-CERAMIC SYSTEMS
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CHIOU, BS; TZENG, JM; DUH, JG |
| 國立交通大學 |
2014-12-08T15:03:30Z |
LIQUID-PHASE BONDING OF YTTRIA-STABILIZED ZIRCONIA WITH CAO-TIO2-SIO2 GLASS
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CHIOU, BS; YOUNG, CD; DUH, JG |
| 國立交通大學 |
2014-12-08T15:03:14Z |
METALLURGICAL REACTIONS AT THE INTERFACE OF SN/PB SOLDER AND ELECTROLESS COPPER-PLATED ALN SUBSTRATE
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CHIOU, BS; CHANG, JH; DUH, JG |
| 國立交通大學 |
2014-12-08T15:03:03Z |
Temperature cycling effects between Sn/Pb solder and electroless copper plated AIN substrate
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Chiou, BS; Chang, JH; Duh, JG |
Showing items 36-43 of 43 (2 Page(s) Totally)
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