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Institution Date Title Author
臺大學術典藏 2018-09-10T09:25:10Z Bandwidth enhancement based on optimized via location for multiple vias EBG power/ground planes C.-D. Wang;Y.-M. Yu;F. d. Paulis;A. C. Scogna;A. Orl;i;Y.-P. Chiou;T.-L. Wu; C.-D. Wang; Y.-M. Yu; F. d. Paulis; A. C. Scogna; A. Orl; i; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU; YIH-PENG CHIOU
臺大學術典藏 2018-09-10T09:25:10Z Bandwidth enhancement based on optimized via location for multiple vias EBG power/ground planes C.-D. Wang;Y.-M. Yu;F. d. Paulis;A. C. Scogna;A. Orl;i;Y.-P. Chiou;T.-L. Wu; C.-D. Wang; Y.-M. Yu; F. d. Paulis; A. C. Scogna; A. Orl; i; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU; YIH-PENG CHIOU
臺大學術典藏 2018-09-10T08:18:40Z Mitigation of noise coupling in multilayer high-speed PCB: state of the art modeling methodology and EBG technology T.-L. Wu;J. Fan;F. d. Paulis;C.-D. Wang;A. C. Scogna;A. Orl;i; T.-L. Wu; J. Fan; F. d. Paulis; C.-D. Wang; A. C. Scogna; A. Orl; i; Wu, Tzong-Lin
臺大學術典藏 2018-09-10T08:18:40Z Mitigation of noise coupling in multilayer high-speed PCB: state of the art modeling methodology and EBG technology T.-L. Wu;J. Fan;F. d. Paulis;C.-D. Wang;A. C. Scogna;A. Orl;i; T.-L. Wu; J. Fan; F. d. Paulis; C.-D. Wang; A. C. Scogna; A. Orl; i; Wu, Tzong-Lin

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