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机构 日期 题名 作者
國立中山大學 2009-12 A dual-conversion zero-IF design for DVB-H RF tuner applications Y.C. Lin;Y.J. Lian;F.Y. Han;K.C. Lu;T.S. Horng;J.M. Wu
國立中山大學 2009-06 Packaging effects on the figure of merit of a CMOS cascode low-noise amplifier: flip-chip versus wire-bond F.Y. Han;K.C. Lu;T.S. Horng;J. Lin;H.H. Cheng;C.T. Chiu;C.P. Hung
國立中山大學 2009-05 Packaging effects on degrading the figure of merit of a CMOS low-noise amplifier: flip-chip versus wirebond F.Y. Han;K.C. Lu;T.S. Horng;J.Y. Li;C.C. Chen;H.H. Chen;C.T. Chiu;C.P Hung
國立高雄師範大學 2006-10 A rigorous study of package and PCB effects on W-CDMA upconverter RFICs Jian-Ming Wu;F.Y. Han;T.S. Horng; 吳建銘
國立中山大學 2006-10 A rigorous study of package and PCB effects on W-CDMA upconverter RFICs F.Y. Han; J.M. Wu; T.S. Horng; C.C. Tu
國立高雄師範大學 2006-09 A rigorous comparison of package and PCB effects on micromixer- and Gilbert mixer-based upconverter MMICs Jian-Ming Wu;F. Y. Han;J. M. Wu;T. S. Horng; 吳建銘
國立中山大學 2006-09 A rigorous comparison of package and PCB effects on micromixer- and Gilbert mixer-based upconverter MMICs F.Y. Han;J.M. Wu;T.S. Horng
國立高雄師範大學 2006-06 Direct-conversion quadrature modulator MMIC design with a new 90 degrees phase shifter including package and PCB effects for W-CDMA applications Jian-Ming Wu;F.Y. Han;T.S. Horng;J. Lin; 吳建銘
國立高雄師範大學 2006-06 Implementation of a W-CDMA direct-conversion IQ modulator module including evaluation of chip-package-board interactions Jian-Ming Wu;F. Y. Han;T. S. Horng;J. Lin;C. C. Tu; 吳建銘
國立中山大學 2006-06 Direct-conversion quadrature modulator MMIC design with a new 90 degrees phase shifter including package and PCB effects for W-CDMA applications J.M. Wu;F.Y. Han; T.S. Horng; J. Lin
國立中山大學 2006-06 Implementation of a W-CDMA direct-conversion IQ modulator module including evaluation of chip-package-board interactions F.Y. Han;J.M. Wu;T.S. Horng;J. Lin
國立中山大學 2006 A rigorous study of package and PCB effects on W-CDMA upconverter RFICs F.Y. Han;J.M. Wu;T.S. Horng;C.C. Tu
國立中山大學 2006 Direct-conversion quadrature modulator MMIC design with a new 90 degrees phase shifter including package and PCB effects for W-CDMA applications J.M. Wu;F.Y. Han;T.S. Horng;J. Lin
國立高雄師範大學 2005-12 A rigorous study of package and PCB effects on W-CDMA RFICs Jian-Ming Wu;F. Y. Han;T. S. Horng;C. C. Tu; 吳建銘
國立中山大學 2005-12 A rigorous study of package and PCB effects on W-CDMA RFICs F.Y. Han;J.M. Wu;T.S. Horng;C.C. Tu
國立高雄師範大學 2005-11 Evaluation of package and PCB effects on RFICs in W-CDMA applications Jian-Ming Wu;F. Y. Han;T. S. Horng;C. C. Tu; 吳建銘
國立中山大學 2005-11 Evaluation of package and PCB effects on RFICs in W-CDMA applications F.Y. Han;J.M. Wu;T.S. Horng;C.C. Tu
國立高雄師範大學 2005-10 Direct-conversion quadrature modulator MMIC design with a new 90 degrees phase shifter including package and PCB effects for W-CDMA applications Jian-Ming Wu;F. Y. Han;T. S. Horng;J. Lin; 吳建銘
國立高雄師範大學 2005-10 Chip-Package-Board Codesign of W-CDMA RFICs Jian-Ming Wu;F. Y. Han;T. S. Horng; 吳建銘
國立中山大學 2005-10 Chip-Package-Board Codesign of W-CDMA RFICs F.Y. Han;J.M. Wu;T.S. Horng
國立中山大學 2005-10 Direct-conversion quadrature modulator MMIC design with a new 90 degrees phase shifter including package and PCB effects for W-CDMA applications J.M. Wu;F.Y. Han;T.S. Horng;J. Lin
國立中山大學 2005-10 A novel closed-form approach for comparing the Q-factor responses between the asymmetric and symmetric on-chip inductors T.S. Horng;C.H. Huang;F.Y. Han;C.J. Li
國立高雄師範大學 2005-06 Chip-package-board codesign of highly linear 3G-CDMA upconverter modules Jian-Ming Wu;F. Y. Han;T. S. Horng;C. C. Tu;R. Chen;C.H. Chu; 吳建銘
國立中山大學 2005-06 Chip-package-board codesign of highly linear 3G-CDMA upconverter modules F.Y. Han;J.M. Wu;T.S. Horng;C.C. Tu;R. Chen;C.H. Chu
國立高雄師範大學 2004-10 Package and PCB effects on linearity of a micromixer-based W-CDMA upconverter Jian-Ming Wu;F. Y. Han;J. K. Jau;T.S. Horng; 吳建銘

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