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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
國立中山大學 2006-06 Implementation of a W-CDMA direct-conversion IQ modulator module including evaluation of chip-package-board interactions F.Y. Han;J.M. Wu;T.S. Horng;J. Lin
國立中山大學 2006 A rigorous study of package and PCB effects on W-CDMA upconverter RFICs F.Y. Han;J.M. Wu;T.S. Horng;C.C. Tu
國立中山大學 2006 Direct-conversion quadrature modulator MMIC design with a new 90 degrees phase shifter including package and PCB effects for W-CDMA applications J.M. Wu;F.Y. Han;T.S. Horng;J. Lin
國立高雄師範大學 2005-12 A rigorous study of package and PCB effects on W-CDMA RFICs Jian-Ming Wu;F. Y. Han;T. S. Horng;C. C. Tu; 吳建銘
國立中山大學 2005-12 A rigorous study of package and PCB effects on W-CDMA RFICs F.Y. Han;J.M. Wu;T.S. Horng;C.C. Tu
國立高雄師範大學 2005-11 Evaluation of package and PCB effects on RFICs in W-CDMA applications Jian-Ming Wu;F. Y. Han;T. S. Horng;C. C. Tu; 吳建銘
國立中山大學 2005-11 Evaluation of package and PCB effects on RFICs in W-CDMA applications F.Y. Han;J.M. Wu;T.S. Horng;C.C. Tu
國立高雄師範大學 2005-10 Direct-conversion quadrature modulator MMIC design with a new 90 degrees phase shifter including package and PCB effects for W-CDMA applications Jian-Ming Wu;F. Y. Han;T. S. Horng;J. Lin; 吳建銘
國立高雄師範大學 2005-10 Chip-Package-Board Codesign of W-CDMA RFICs Jian-Ming Wu;F. Y. Han;T. S. Horng; 吳建銘
國立中山大學 2005-10 Chip-Package-Board Codesign of W-CDMA RFICs F.Y. Han;J.M. Wu;T.S. Horng

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