臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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"f y han"

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Institution	Date	Title	Author
國立中山大學	2006-06	Implementation of a W-CDMA direct-conversion IQ modulator module including evaluation of chip-package-board interactions	F.Y. Han;J.M. Wu;T.S. Horng;J. Lin
國立中山大學	2006	A rigorous study of package and PCB effects on W-CDMA upconverter RFICs	F.Y. Han;J.M. Wu;T.S. Horng;C.C. Tu
國立中山大學	2006	Direct-conversion quadrature modulator MMIC design with a new 90 degrees phase shifter including package and PCB effects for W-CDMA applications	J.M. Wu;F.Y. Han;T.S. Horng;J. Lin
國立高雄師範大學	2005-12	A rigorous study of package and PCB effects on W-CDMA RFICs	Jian-Ming Wu;F. Y. Han;T. S. Horng;C. C. Tu; 吳建銘
國立中山大學	2005-12	A rigorous study of package and PCB effects on W-CDMA RFICs	F.Y. Han;J.M. Wu;T.S. Horng;C.C. Tu
國立高雄師範大學	2005-11	Evaluation of package and PCB effects on RFICs in W-CDMA applications	Jian-Ming Wu;F. Y. Han;T. S. Horng;C. C. Tu; 吳建銘
國立中山大學	2005-11	Evaluation of package and PCB effects on RFICs in W-CDMA applications	F.Y. Han;J.M. Wu;T.S. Horng;C.C. Tu
國立高雄師範大學	2005-10	Direct-conversion quadrature modulator MMIC design with a new 90 degrees phase shifter including package and PCB effects for W-CDMA applications	Jian-Ming Wu;F. Y. Han;T. S. Horng;J. Lin; 吳建銘
國立高雄師範大學	2005-10	Chip-Package-Board Codesign of W-CDMA RFICs	Jian-Ming Wu;F. Y. Han;T. S. Horng; 吳建銘
國立中山大學	2005-10	Chip-Package-Board Codesign of W-CDMA RFICs	F.Y. Han;J.M. Wu;T.S. Horng

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