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Institution	Date	Title	Author
國立成功大學	2021	The Dynamic Behavior of Electromigration in a Novel Cu Tall Pillar/Cu Via Interconnect for Fan-out Packaging	Liang, C.-L.;Tsai, M.-Y.;Lin, Y.-S.;Lin, I.-T.;Yang, S.-W.;Huang, M.-L.;Fang, J.-K.;Lin, K.-L.

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