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Institution Date Title Author
國立成功大學 2016-08-16 Effect of annealing temperature on electrical and reliability characteristics of HfO2/porous low-k dielectric stacks Cheng, Yi-Lung; Kao, Kai-Chieh; Chen, Giin-Shan; Fang, Jau-Shiung; Sun, Chung-Ren; Lee, Wen-Hsi
國立交通大學 2015-07-21T08:27:56Z STRUCTURES AND PROPERTIES OF THE CRYSTALLINE Si-C-N USING ADDITIONAL Si-SOURCE AND Co-CATALYST Chang, Hui Lin; Fang, Jau Shiung; Kuo, Cheng Tzu
國立虎尾科技大學 2007 5-nm-thick TaSiC amorphous films stable up to 750 °C as a diffusion barrier for copper metallization Lin, Ting-Yi;Cheng, Huai-Yu;Chin, Tsung-Shune;Chiu, Chin-Fu;Fang, Jau-Shiung

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