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"fang kl"的相關文件
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| 國立交通大學 |
2014-12-08T15:43:20Z |
Surface-processing-enhanced copper diffusion into fluorosilicate glass
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Tsui, BY; Fang, KL; Lee, SD |
| 國立交通大學 |
2014-12-08T15:40:53Z |
Metal drift induced electrical instability of porous low dielectric constant film
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Fang, KL; Tsui, BY |
| 國立交通大學 |
2014-12-08T15:39:47Z |
Anisotropic thermal conductivity of nanoporous silica film
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Tsui, BY; Yang, CC; Fang, KL |
| 國立交通大學 |
2014-12-08T15:37:09Z |
Electrical stability and reliability of ultralow dielectric constant porous carbon-doped oxide film for copper interconnect
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Fang, KL; Tsui, BY |
| 國立交通大學 |
2014-12-08T15:27:01Z |
Electrical reliability issues of integrating low-K dielectrics with Cu metallization
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Wu, ZC; Shiung, ZW; Wang, CC; Fang, KL; Wu, RG; Liu, YL; Tsui, BY; Chen, MC; Chang, W; Chou, PF; Jang, SM; Yu, CH; Liang, MS |
| 國立交通大學 |
2014-12-08T15:26:46Z |
Electrical reliability of low dielectric constant diffusion barrier (a-SiC : H) for copper interconnect
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Fang, KL; Tsui, BY; Yang, CC; Lee, SD |
| 國立交通大學 |
2014-12-08T15:26:35Z |
Electrical and material stability of Orion(TM) CVD ultra low-k dielectric film for copper interconnection
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Fang, KL; Tsui, BY; Yang, CC; Chen, MC; Lee, SD; Beekmann, K; Tony, W; Giles, K; Ishaq, S |
| 國立交通大學 |
2014-12-08T15:26:21Z |
Anisotropic thermal conductivity of nano-porous silica film
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Tsui, BY; Yang, CC; Fang, KL |
| 國立交通大學 |
2014-12-08T15:26:19Z |
A novel wafer reclaim method for silicon carbide film
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Tsui, BY; Fang, KL; Wu, CH; Li, YH |
| 國立交通大學 |
2014-12-08T15:18:11Z |
A novel wafer reclaim method for amorphous SiC and carbon doped oxide films
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Tsui, BY; Fang, KL |
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