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Showing items 1-6 of 6  (1 Page(s) Totally)
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Institution Date Title Author
義守大學 2013-10 Electrochemical migration failure on FR-4 PCB by hygro-thermo-vapor pressure coupled analysis Hsiang-Chen Hsu;Shih-Jeh Wu;Feng-Jui Hsu;Meng-Chieh Weng;Shen-Li Fu
義守大學 2010 微機電製程壓力感測器之熱-濕-壓-固耦合與可靠度分析 許峰瑞; Feng-jui Hsu
建國科技大學 2010 以服務設計角度探討數位學習平台融入大學設計相關課程教學環境之研究 黃絜如;Chieh Ju Huang; 游淑凰;Shu Huang Yu; 許峰瑞;Feng Jui Hsu
義守大學 2009/08/10 Advanced moisture diffusion model and hygro-thermo-mechanical design for flip chip BGA package Ming-Han Tsai ; Feng-Jui Hsu ; Meng-Chieh Weng ; Hsiang-Chen Hsu
義守大學 2008/10/22 Hygroscopic Swelling Effect on Polymeric Materials and Thermo-hygro-mechanical Design on Finger Printer Package Hsiang-Chen Hsu;Yu-Teng Hsu ; Wen-Lo Hsich ; Meng-Chieh Weng ; Shao-Tang ZhangJian ; Feng-Jui Hsu ; Yi-Feng Chen ; Shen-Li Fu
義守大學 2008 Hygroscopic Swelling Effect on Polymeric Materials and Thermo-hygro-mechanical Design on Finger Printer Package Hsiang-Chen Hsu; Yu-Teng Hsu; Wen-Lo Hsich; Meng-Chieh Weng; Shao-Tang ZhangJian; Feng-Jui Hsu; Yi-Feng Chen; Shen-Li Fu

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