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| 臺大學術典藏 |
2020-05-12T02:53:09Z |
Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder
|
Chang, S.Y.; Jain, C.C.; Chuang, T.H.; Feng, L.P.; Tsao, L.C.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2011 |
Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder
|
Chang, S.Y.; Jain, C.C.; Chuang, T.H.; Feng, L.P.; Tsao, L.C. |
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