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Showing items 56-65 of 118  (12 Page(s) Totally)
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Institution Date Title Author
國立交通大學 2014-12-08T15:36:01Z Pattern effect optimized with non-native surface passivation in copper abrasive-free polishing Fang, JY; Tsai, MS; Dai, BT; Wu, YS; Feng, MS
國立交通大學 2014-12-08T15:27:44Z Study of Schottky barriers on n-type GaN grown by LP-MOCVD Guo, JD; Feng, MS; Pan, FM
國立交通大學 2014-12-08T15:27:44Z Process-related instability mechanisms for the hydrogenated amorphous silicon thin film transistors Tai, YH; Su, FC; Feng, MS; Cheng, HC
國立交通大學 2014-12-08T15:27:43Z Fabrication and characterization of the Pd-silicided emitters for field-emission devices Wang, CC; Ku, TK; Feng, MS; Hsieh, IJ; Cheng, HC
國立交通大學 2014-12-08T15:27:24Z Modified double-layer PECVD passivation films for improving nonvolatile memory IC performance Lin, CF; Tseng, WT; Feng, MS; Chang, YF
國立交通大學 2014-12-08T15:27:17Z ULSI multi-layer thin film passivation processes for improving cache memory performance Lin, CF; Tseng, WT; Feng, MS; Chang, YF; Hsu, JJ
國立交通大學 2014-12-08T15:27:11Z A study on electrochemical metrologies for evaluating the removal selectivity of AlCMP Chiu, SY; Hsu, JW; Tung, IC; Shih, HC; Feng, MS; Tsai, MS; Dai, BT
國立交通大學 2014-12-08T15:27:08Z Study of a common deep level in GaN Wen, TC; Lee, SC; Lee, WI; Guo, JD; Feng, MS
國立交通大學 2014-12-08T15:27:05Z Study on chemical-mechanical polishing of low dielectric constant polyimide thin films Tai, YL; Tsai, MS; Tung, IC; Dai, BT; Feng, MS
國立交通大學 2014-12-08T15:26:56Z Technology of electroplating copper with low-K material a-C : F for 0.15 mu m damascene interconnection Shieh, JM; Suen, SC; Lin, KC; Chang, SC; Dai, BT; Chen, CF; Feng, MS

Showing items 56-65 of 118  (12 Page(s) Totally)
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