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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Showing items 61-70 of 118  (12 Page(s) Totally)
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Institution Date Title Author
國立交通大學 2014-12-08T15:27:17Z ULSI multi-layer thin film passivation processes for improving cache memory performance Lin, CF; Tseng, WT; Feng, MS; Chang, YF; Hsu, JJ
國立交通大學 2014-12-08T15:27:11Z A study on electrochemical metrologies for evaluating the removal selectivity of AlCMP Chiu, SY; Hsu, JW; Tung, IC; Shih, HC; Feng, MS; Tsai, MS; Dai, BT
國立交通大學 2014-12-08T15:27:08Z Study of a common deep level in GaN Wen, TC; Lee, SC; Lee, WI; Guo, JD; Feng, MS
國立交通大學 2014-12-08T15:27:05Z Study on chemical-mechanical polishing of low dielectric constant polyimide thin films Tai, YL; Tsai, MS; Tung, IC; Dai, BT; Feng, MS
國立交通大學 2014-12-08T15:26:56Z Technology of electroplating copper with low-K material a-C : F for 0.15 mu m damascene interconnection Shieh, JM; Suen, SC; Lin, KC; Chang, SC; Dai, BT; Chen, CF; Feng, MS
國立交通大學 2014-12-08T15:26:54Z AIGaN Schottky characteristics after hybrid photo-enhanced wet and inductively coupled plasma etch Huang, WJ; Fang, CY; Wong, JS; Lee, CS; Chang, EY; Feng, MS
國立交通大學 2014-12-08T15:26:53Z AIGaN/GaN HEMT sub-bands study using low-temperature photoluminescence Fang, CY; Lin, CF; Lee, CS; Chang, EY; Feng, MS
國立交通大學 2014-12-08T15:26:17Z Low temperature polycrystalline silicon thin film transistors fabricated by electroless plating Ni induced crystallization of amorphous Si Chao, CW; Wu, YCS; Chen, YC; Hu, GR; Feng, MS
國立交通大學 2014-12-08T15:19:18Z Aplication of plasma immersion ion implantation on seeding copper electroplating for multilevel interconnection Chiu, SY; Wang, YL; Chang, SC; Feng, MS
國立交通大學 2014-12-08T15:17:43Z Effect of surface passivation removal on planarization efficiency in Cu abrasive-free polishing Fang, JY; Tsai, MS; Dai, BT; Wu, YS; Feng, MS

Showing items 61-70 of 118  (12 Page(s) Totally)
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