| 臺大學術典藏 |
2022-03-22T08:30:21Z |
White X-ray nanodiffraction study of allotropic phase transformation of hexagonal- Into monoclinic-Cu6Sn5
|
Lee P.-T;Hsieh W.-Z;Lee C.-Y;Kao C.R;Ho C.-E.; Lee P.-T; Hsieh W.-Z; Lee C.-Y; Kao C.R; Ho C.-E.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:20Z |
White X-ray nanodiffraction study of allotropic phase transformation of hexagonal- Into monoclinic-Cu6Sn5
|
Lee P.-T;Hsieh W.-Z;Lee C.-Y;Kao C.R;Ho C.-E.; Lee P.-T; Hsieh W.-Z; Lee C.-Y; Kao C.R; Ho C.-E.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:27:22Z |
White X-ray nanodiffraction study of allotropic phase transformation of hexagonal- Into monoclinic-Cu6Sn5
|
Lee P.-T;Hsieh W.-Z;Lee C.-Y;Kao C.R;Ho C.-E.; Lee P.-T; Hsieh W.-Z; Lee C.-Y; Kao C.R; Ho C.-E.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:12Z |
Phase relation in the titanium-rich region of the Ge-Si-Ti ternary system
|
C. ROBERT KAO;Kao C.R.;Ho C.E.;Huang C.G.;Jain T.A.; Jain T.A.; Huang C.G.; Ho C.E.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:11Z |
Optimizing the wire-bonding parameters for second bonds in ball grid array packages
|
C. ROBERT KAO;Kao C.R.;Chen C.;Ho C.E.; Ho C.E.; Chen C.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:02Z |
Volume effect on the soldering reaction between SnAgCu solders and Ni
|
C. ROBERT KAO;Kao C.R.;Yang S.C.;Lin Y.W.;Ho C.E.; Ho C.E.; Lin Y.W.; Yang S.C.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:56Z |
Effect of Zn addition on the interfacial reactions between Cu and lead-free solders
|
C. ROBERT KAO;Kao C.R.;Chang C.-W.;Ho C.-E.;Yang S.-C.; Yang S.-C.; Ho C.-E.; Chang C.-W.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:56Z |
Massive spalling of intermetallic compound in lead-free solder joints
|
C. ROBERT KAO;Kao C.R.;Chang C.-W.;Ho C.-E.;Yang S.-C.; Yang S.-C.; Ho C.-E.; Chang C.-W.; Kao C.R.; C. ROBERT KAO |
| 國立臺灣科技大學 |
2019 |
Structural health monitoring and interface damage detection for infill reinforced concrete walls in seismic retrofit of reinforced concrete frames using piezoceramic-based transducers under the cyclic loading
|
Liao, W.-I.;Hsiao, F.-P.;Chiu, Chiu C.-K.;Ho, C.-E. |
| 國立臺灣科技大學 |
2019 |
Crack-based damage quantification for shear-critical HSRC column members using piezoceramic transducers
|
Chiu, Chiu C.-K.;Sugianto, Sugianto S.;Liao, W.-I.;Ho, C.-E. |
| 國立臺灣科技大學 |
2019 |
Retrofitting non-ductile rc frames for seismic resistance using post-installed shear walls
|
Chiu, Chiu C.-K.;Hsiao, F.-P.;Liao, W.-I.;Quacoo, S.J.;Ho, C.-E.;Gu, Z.-E. |
| 國立成功大學 |
2013-10-01 |
Electron backscatter diffraction analysis on the microstructures of electrolytic Cu deposition in the through hole filling process
|
Ho, C. E.; Liao, C. W.; Pan, C. X.; Chen, H. J.; Kuo, J. C.; Chen, D. |
| 國立臺灣科技大學 |
2010 |
Application of computer vision in the automatic identification and classification of woven fabric weave patterns
|
Kuo C.-F.J.;Shih C.-Y.;Ho C.-E.;Peng K.-C. |
| 國立臺灣大學 |
2007 |
Interfacial reaction issues for lead-free electronic solders
|
Ho, C. E.; Yang, S. C.; Kao, C. R. |
| 國立臺灣大學 |
2007 |
Massive Spalling of Intermetallic in Solder-Substrate Reactions due to limited Supply of the Active Element
|
Yang, S. C.; Ho, C. E.; Chang, C. W.; Kao, C. R. |
| 國立臺灣大學 |
2006 |
Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu
|
Yang, S.C.; Ho, C.E.; Chang, C.W.; Kao, C.R. |
| 國立臺灣大學 |
2005-04 |
Solid-state reactions between Ni and tin-silver-copper solders with different Cu concentrations
|
Luo, W. C.; Ho, C. E.; Tsai, J. Y.; Lin, Y. L.; Kao, and C. R. |
| 國立臺灣大學 |
2004-10 |
Effect of the gold thickness of the surface finish on the interfacial reactions in flip chip solder joints
|
Lin, Y. L.; Luo, W. C.; Lin, Y. H.; Ho, C. E.; Kao, and C. R. |
| 國立臺灣大學 |
2003-07 |
Chemical reaction in advanced microelectronic packages
|
Ho, C. E.; Lin, Y. L.; Tsai, J. Y.; Kao, and C. R. |
| 國立臺灣大學 |
2002-11 |
Inhibiting the formation of (Au1-xNix)Sn4 and reducing the consumption of Ni metallization in solder joints
|
Ho, C. E.; Shiau, L. C.; Kao, and C. R. |
| 國立臺灣大學 |
2002-06 |
Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni
|
Ho, C. E.; Tsai, R. Y.; Lin, Y. L.; Kao, and C. R. |
| 國立臺灣大學 |
2002-05 |
Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni
|
Ho, C. E.; Lin, Y. L.; Kao, and C. R. |
| 國立臺灣大學 |
2002-03 |
Reactions between SnAgCu lead-free solders and the Au/Ni surface finish in advanced electronic packages
|
Shiau, L. C.; Ho, C. E.; Kao, and C. R. |
| 國立臺灣大學 |
2002-02 |
Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders
|
Chen, W. T.; Ho, C. E.; Kao, and C. R. |
| 國立臺灣大學 |
2001-11 |
Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering
|
Ho, C. E.; Tsai, S. Y.; Kao, and C. R. |
