臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
中國醫藥大學	2014-04	Low-Temperature Bonded Cu/In Interconnect With High Thermal Stability for 3-D Integration	(Yu-San Chien);(Yan-Pin Huang);(Ruoh-Ning Tzeng);(Ming-Shaw Shy);(Teu-Hua Lin);(Kou-Hua Chen);(Chi-Tsung Chiu);(Ching-Te Chuang);(Wei Hwang);邱俊誠(Jin-Chern Chiou);(Ho-Ming Tong);(Kuan-Neng Chen)*

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