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Institution Date Title Author
國立聯合大學 2010 Interfacial Reactions, Microstructure, and Strength of Sn-8Zn-3Bi and Sn-9Zn-Al Solder on Cu and Au/Ni (P) Pads Hsi, CS; Lin, CT; Chang, TC; Wang, MC; Liang, MK
國立聯合大學 2009 RF Properties of LTCC BST Thick Film Made by MicroPen Hu, T ; Palukuru, VK; Jantunen, H; Hsi, CS ; Safari, A
國立聯合大學 2009 Low temperature sintering and dielectric properties of BaTiO3 with glass addition Hsiang, HI; Hsi, CS; Huang, CC; Fu, SL
中國文化大學 2002 Interfacial adhesion and microstructure of thick film metallized aluminum nitride substrates Tsai CJ; Tseng WJ; Hsi CS
中國文化大學 2001 Influence of particulate Al2O3 addition on interfacial microstructure and electrical sheet resistance of thick film metallized aluminum nitride substrates Tseng WJ; Tsai CJ; Hsi CS

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