|
English
|
正體中文
|
简体中文
|
2832440
|
|
???header.visitor??? :
33811886
???header.onlineuser??? :
1375
???header.sponsordeclaration???
|
|
|
|
???tair.name??? >
???browser.page.title.author???
|
"hsi cs"???jsp.browse.items-by-author.description???
Showing items 1-5 of 5 (1 Page(s) Totally)
1
View [10|25|50] records per page
| 國立聯合大學 |
2010 |
Interfacial Reactions, Microstructure, and Strength of Sn-8Zn-3Bi and Sn-9Zn-Al Solder on Cu and Au/Ni (P) Pads
|
Hsi, CS; Lin, CT; Chang, TC; Wang, MC; Liang, MK |
| 國立聯合大學 |
2009 |
RF Properties of LTCC BST Thick Film Made by MicroPen
|
Hu, T ; Palukuru, VK; Jantunen, H; Hsi, CS ; Safari, A |
| 國立聯合大學 |
2009 |
Low temperature sintering and dielectric properties of BaTiO3 with glass addition
|
Hsiang, HI; Hsi, CS; Huang, CC; Fu, SL |
| 中國文化大學 |
2002 |
Interfacial adhesion and microstructure of thick film metallized aluminum nitride substrates
|
Tsai CJ; Tseng WJ; Hsi CS |
| 中國文化大學 |
2001 |
Influence of particulate Al2O3 addition on interfacial microstructure and electrical sheet resistance of thick film metallized aluminum nitride substrates
|
Tseng WJ; Tsai CJ; Hsi CS |
Showing items 1-5 of 5 (1 Page(s) Totally)
1
View [10|25|50] records per page
|
