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Institution	Date	Title	Author
義守大學	2016-12	Effects of Surface Forces on Squeeze EHL Motion between Elastic Ball and Elastic Coated Surface	Li-Ming Chu;Jaw-Ren Lin;Hsiang-Chen Hsu;Yuh-Ping Chang
義守大學	2016-10	Reduction of Residual Stresses in Sapphire Cover Glass Induced by Mechanical Polishing and Laser Chamfering Through Etching	Shih-Jeh Wu;Hsiang-Chen Hsu;Wen-Fei Lin
義守大學	2016-09	Squeeze film characteristics of circular contacts at impact and rebound motion with micropolar lubricants	Li-Ming Chu;Jaw-Ren Lin;Yuh-Ping Chang;Hsiang-Chen Hsu
義守大學	2016-09	An investigation on micro-via drilling on ceramic substrates by a picosecond laser	Hsiang-Chen Hsu;Shih-Jeh Wu
義守大學	2016-07	The Application of General Homotopy Method on Planar Four-Bar Path Synthesis	Pei-chieh Chin;Hsiang-chen Hsu;Shen-li Fu
義守大學	2016-04	Through Mold Via (TMV) by gas-aided laser	Hsiang-Chen Hsu;Shih-Jeh Wu;Wen-Fei Lin;Chi-Shiung Hsi;Hsing-Yi Pao;Pin-Chieh Wang
義守大學	2016-04	Reliability design on wearable device for initial osteoarthritis (OA) on knee joints	Hsiang-Chen Hsu;Pin-Chieh Wang;Jia-Jung Wang;Shen-Li Fu
義守大學	2015-12	Power Law Fluid Model Incorporated into Thin Film Elastohydrodynamic Lubrication of Circular Contacts	Li-Ming Chu;Hsiang-Chen Hsu;Chia-Hsiang Su
義守大學	2015-06	Design on MEMS-based 3D biochip for drug-released dispenser	Hsiang-Chen Hsu;Li-Ming Chu;Baojun Liu;Chien-Yuan Lai
義守大學	2015-05	A Layered-Rheology Model for Thin Film Elastohydrodynamic Lubrication of Circular Contacts	Li-Ming Chu;Hsiang-Chen Hsu
義守大學	2015-04	Internal patterning of the glass backlight module for LCD panel by laser	Shih-Jeh Wu;Hsiang-Chen Hsu;Pin-Chieh Wang;Shen-Li Fu
義守大學	2014-12	An investigation on dicing 28-nm node Cu/low-k wafer with a Picosecond Pulse Laser	Hsiang-Chen Hsu;Li-Ming Chu;Baojun Liu;Chih-Chiang Fu
義守大學	2014-10	Laser Grooving Technique for Dicing Nanoscale Low-k Wafer	Hsiang-Chen Hsu
義守大學	2014-10	An experimental study on dicing 28 nm low-k water using laser grooving technique	Hsiang-Chen Hsu;Cheng-Jiun Han;Li-Ming Chu;Shih-Jeh Wu;Chih-Chiang Fu;Shen-Li Fu;Baojun Liu;Chen-Yi Wang;PoChun Jung
義守大學	2014-10	Cutting PCB with a 532nm DPSS green laser	Hsiang-Chen Hsu;Shih-Jeh Wu;Chih-Chiang Fu;Li-Ming Chu;Shen-Li Fu;Trong-Tai Nguyen
義守大學	2014-09	Novel design and fabrication of a geometrical obstacle-embedded micromixer with notched wall	Shih-Jeh Wu;Hsiang-Chen Hsu;Wen-Jui Feng
義守大學	2014-06	Laser drilling and thermal stress analysis on TSV in 3D IC structure	Hsiang-Chen Hsu;Shih-Jeh Wu
義守大學	2014-03	Numerical simulation of high power LED heat-dissipating system	Shih-Jeh Wu;Hsiang-Chen Hsu;Shen-Li Fu;Jiam-Nan Yeh
義守大學	2014-01	Reliability and Bondability Study on Interfacial Behavior between SnAgCu Solder and Cu-Ni-Au OSP Pads	Shen-Li Fu;Hsiang-Chen Hsu;Yue-Min Wan;Chi-Hau Haung
義守大學	2014-01	An Analytical Approach for Analysis of Slider Bearings with Non-Newtonian Lubricants	Li-Ming Chu;Hsiang-Chen Hsu;Jiann-Lin Chen
義守大學	2013-10	Thermal design for high power arrayed LED heat-dissipating system	Hsiang-Chen Hsu;Shih-Jeh Wu;Jyun-Yi Li;Jing-Wen Su;Jian-Siang Huang;Shen-Li Fu
義守大學	2013-10	Electrochemical migration failure on FR-4 PCB by hygro-thermo-vapor pressure coupled analysis	Hsiang-Chen Hsu;Shih-Jeh Wu;Feng-Jui Hsu;Meng-Chieh Weng;Shen-Li Fu
義守大學	2013-10	An investigation on nanoscale bondability between Cu-Al intermetallic compound	Hsiang-Chen Hsu;Jih-Hsin Chien;Chen-Yi Wang;Li-Ming Chu;Shin-Pon Ju;Shen-Li Fu;Miin Shyan Bai
義守大學	2013-09	Further characterization of Pd-coated copper wire on wirebonding process: from a nanoscale perspective	Hsiang-Chen Hsu;Li-Ming Chu;Wei-Yao Chang;Yi-Feng Chen;Jih-Hsin Chien;Shen-Li Fu;Shin-Pon Ju;Wen-Jui Feng
義守大學	2013-04	Effects of Surface Roughness and Flow Rheology on the EHL of Circular Contacts with Power-Law Fluid	Li-Ming Chu;Jaw-Ren Lin;Hsiang-Chen Hsu;Yuh-Ping Chang

Showing items 11-35 of 111 (5 Page(s) Totally)
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