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Showing items 31-55 of 111  (5 Page(s) Totally)
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Institution Date Title Author
義守大學 2013-10 Thermal design for high power arrayed LED heat-dissipating system Hsiang-Chen Hsu;Shih-Jeh Wu;Jyun-Yi Li;Jing-Wen Su;Jian-Siang Huang;Shen-Li Fu
義守大學 2013-10 Electrochemical migration failure on FR-4 PCB by hygro-thermo-vapor pressure coupled analysis Hsiang-Chen Hsu;Shih-Jeh Wu;Feng-Jui Hsu;Meng-Chieh Weng;Shen-Li Fu
義守大學 2013-10 An investigation on nanoscale bondability between Cu-Al intermetallic compound Hsiang-Chen Hsu;Jih-Hsin Chien;Chen-Yi Wang;Li-Ming Chu;Shin-Pon Ju;Shen-Li Fu;Miin Shyan Bai
義守大學 2013-09 Further characterization of Pd-coated copper wire on wirebonding process: from a nanoscale perspective Hsiang-Chen Hsu;Li-Ming Chu;Wei-Yao Chang;Yi-Feng Chen;Jih-Hsin Chien;Shen-Li Fu;Shin-Pon Ju;Wen-Jui Feng
義守大學 2013-04 Effects of Surface Roughness and Flow Rheology on the EHL of Circular Contacts with Power-Law Fluid Li-Ming Chu;Jaw-Ren Lin;Hsiang-Chen Hsu;Yuh-Ping Chang
義守大學 2013-02 Finite Element Modeling of SnAgCu Alloy on 3D Package-on-Package (POP) Subjected to Board Level Drop Test Hsiang-Chen Hsu;Shen-Wen Ju;Shih-Jeh Wu;Miin-Shyan Bair
義守大學 2012-12 An investigation on secondary EFO copper wire - from a nanoscale perspective view Hsiang-Chen Hsu;Jih-Hsin Chien;Chen-Yi Wang;Cheng-Che Liu;Shen-Li Fu;Miin Shyan Bair
義守大學 2012-10 Inverse approach for the pressure, temperature, and pressure-viscosity index determination in TEHL of line contacts Li-Ming Chu;Hsiang-Chen Hsu;Jaw-Ren Lin;Yuh-Ping Chang
義守大學 2012-10 Nanoscale bondability study on copper-aluminum intermetallic compound using molecular dynamics simulation Hsiang-Chen Hsu;Jih-Hsin Chien;Li-Ming Chu;Shin-Pon Ju;Yu-Ting Feng;Shen-Li Fu
義守大學 2012-07 Study on the Performance and Exhaust Emissions of Motorcycle Engine Fuelled with Hydrogen-Gasoline Compound Fuel Chang-Huei Lin;Li-Ming Chu ;Hsiang-Chen Hsu
義守大學 2012-07 Simulation of Internal Fixation Surgery for Calcaneal Collapse with 3D full-sized Computer-Aided Technology Shuh-Ping Sun;Hsiang-Chen Hsu;Yi-Jiun Chou
義守大學 2012-06 Chaotic Responses on Gear Pair System Equipped with Journal Bearings under Turbulent Flow Cai-Wan Chang-Jian;Hsiang-Chen Hsu
義守大學 2012-04 Electronics Packaging Technology Research and Development in Taiwan Shen-Li Fu;Wei-Chung Lo;Hsiang-Chen Hsu
義守大學 2012-03 Microfluidic Synthesis of Microfibers for Magnetic-Responsive Controlled Drug Release and Cell Culture Yung-Sheng Lin;Keng-Shiang Huang;Chih-Hui Yang;Chih-Yu Wang;Yuh-Shyong Yang;Hsiang-Chen Hsu;Yu-Ju Liao;Chia-Wen Tsai
義守大學 2012-03 An Investigation on Mechanical Behavior on Pt-Coated Copper Wire from a Nanoscale Perspective Hsiang-Chen Hsu;Guo-Wei Li ;W. R. Feng;Chun-Hsien Kuo
義守大學 2012-03 Effects of Electric Double Layer on Pure Squeeze Motion of Circular Contacts – An Elastohydrodynamic Lubrication Model Li-Ming Chu;Wang-Long Li;Hsiang-Chen Hsu;Jung-Shun Tsai
義守大學 2012-03 An Innovative Approach to Fiber-To-The-Home (FTTH) Hsiang-Chen Hsu;Don Liu;Shu-Sen Tieh;Chun-Hsien Kuo
義守大學 2011-10 Nonlinear Analysis of Porous Squeeze Film Damper-Mounted a Rotor with Non-Linear Suspension and Roughness Effect Cai-Wan Chang-jian;Hsiang-Chen Hsu;Jiann-Lin Chen;Guan-I Wu
義守大學 2011-10 An investigation of temperature influence on the SAC305 soldering on Cu-Ni-Au substrate Hsiang-Chen Hsu;Yu-Ming Wan;Chi-Hau Haung;Shen-Li Fu
義守大學 2011-10 A study on Nano-mechanical properties and nano-tribology for ultra-thin Pt-coated 4N copper wire Hsiang-Chen Hsu;Jih-Hsin Chien;Shen-Li Fu
義守大學 2011-06 Squeeze Film Characteristics of Circular Contacts at Constant Squeeze Velocity Motion with Non-Newtonian Lubricants Li-Ming Chu;Wang-Long Li;Hsiang-Chen Hsu
義守大學 2011-06 Hygro-Thermo-Vapor Pressure Coupled Model on Premold QFN CMOS Image Sensor Hsiang-Chen Hsu;Li-Ming Chu;Shen-Li Fu
義守大學 2011-05 Nanotribology Properties and Microscopic Interfacial Frictional Behavior Studied by Atomic Force Microscopy Hsiang-Chen Hsu;Li-Ming Chu
義守大學 2011-01 Fabrication of Microfluidic Rapid Micromixer Hsiang-Chen Hsu;Hsi-Chien Liu;Cheng-Jiun Han
義守大學 2011-01 Characteristic of copper wire and transient analysis on wirebonding process Hsiang-Chen Hsu;Wei-Yao Chang;Chang-Lin Yeh;Yi-Shao Lai

Showing items 31-55 of 111  (5 Page(s) Totally)
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