臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

About TAIR
	About TAIR

Browse By
	Institution
	Author
	Title
	Date
	Statistics Chart
	Institution Facts
	Trend

News
	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

Copyright
	Publisher & Journal Policy
	TAIR Copyright Conference Minutes

Related Links
	機構典藏計畫網站
	ROAR
	OpenDOAR
	SHERPA
	OAIster
	JAIRO
	Ira
	DSPACE
	RWWR
	臺大學術典藏NTU Scholars

"hsiang chen hsu"

Return to Browse by Author
Sorting by Title	Sort by Date

Showing items 41-65 of 111 (5 Page(s) Totally)
<< < 1 2 3 4 5 > >>
View [10|25|50] records per page

Institution	Date	Title	Author
義守大學	2012-07	Simulation of Internal Fixation Surgery for Calcaneal Collapse with 3D full-sized Computer-Aided Technology	Shuh-Ping Sun;Hsiang-Chen Hsu;Yi-Jiun Chou
義守大學	2012-06	Chaotic Responses on Gear Pair System Equipped with Journal Bearings under Turbulent Flow	Cai-Wan Chang-Jian;Hsiang-Chen Hsu
義守大學	2012-04	Electronics Packaging Technology Research and Development in Taiwan	Shen-Li Fu;Wei-Chung Lo;Hsiang-Chen Hsu
義守大學	2012-03	Microfluidic Synthesis of Microfibers for Magnetic-Responsive Controlled Drug Release and Cell Culture	Yung-Sheng Lin;Keng-Shiang Huang;Chih-Hui Yang;Chih-Yu Wang;Yuh-Shyong Yang;Hsiang-Chen Hsu;Yu-Ju Liao;Chia-Wen Tsai
義守大學	2012-03	An Investigation on Mechanical Behavior on Pt-Coated Copper Wire from a Nanoscale Perspective	Hsiang-Chen Hsu;Guo-Wei Li ;W. R. Feng;Chun-Hsien Kuo
義守大學	2012-03	Effects of Electric Double Layer on Pure Squeeze Motion of Circular Contacts – An Elastohydrodynamic Lubrication Model	Li-Ming Chu;Wang-Long Li;Hsiang-Chen Hsu;Jung-Shun Tsai
義守大學	2012-03	An Innovative Approach to Fiber-To-The-Home (FTTH)	Hsiang-Chen Hsu;Don Liu;Shu-Sen Tieh;Chun-Hsien Kuo
義守大學	2011-10	Nonlinear Analysis of Porous Squeeze Film Damper-Mounted a Rotor with Non-Linear Suspension and Roughness Effect	Cai-Wan Chang-jian;Hsiang-Chen Hsu;Jiann-Lin Chen;Guan-I Wu
義守大學	2011-10	An investigation of temperature influence on the SAC305 soldering on Cu-Ni-Au substrate	Hsiang-Chen Hsu;Yu-Ming Wan;Chi-Hau Haung;Shen-Li Fu
義守大學	2011-10	A study on Nano-mechanical properties and nano-tribology for ultra-thin Pt-coated 4N copper wire	Hsiang-Chen Hsu;Jih-Hsin Chien;Shen-Li Fu
義守大學	2011-06	Squeeze Film Characteristics of Circular Contacts at Constant Squeeze Velocity Motion with Non-Newtonian Lubricants	Li-Ming Chu;Wang-Long Li;Hsiang-Chen Hsu
義守大學	2011-06	Hygro-Thermo-Vapor Pressure Coupled Model on Premold QFN CMOS Image Sensor	Hsiang-Chen Hsu;Li-Ming Chu;Shen-Li Fu
義守大學	2011-05	Nanotribology Properties and Microscopic Interfacial Frictional Behavior Studied by Atomic Force Microscopy	Hsiang-Chen Hsu;Li-Ming Chu
義守大學	2011-01	Fabrication of Microfluidic Rapid Micromixer	Hsiang-Chen Hsu;Hsi-Chien Liu;Cheng-Jiun Han
義守大學	2011-01	Characteristic of copper wire and transient analysis on wirebonding process	Hsiang-Chen Hsu;Wei-Yao Chang;Chang-Lin Yeh;Yi-Shao Lai
義守大學	2010-12	Advanced Finite Element Model on Copper Wire Ball Bonding	Hsiang-Chen Hsu;Hong-Shen Chang;Shu-Chi Tsao;Shen-Li Fu
義守大學	2010-10	Thermal aging effect on copper wire and micro interfacial frictional behavior along Cu FAB and Al pad	Hsiang-Chen Hsu;Chih-Chiang Fu;Hong-Shen Chang;Shen-Li Fu;Huang-Kuang Kung
義守大學	2010-10	The effect of cross-section geometry of bonding wire on wire sweep for semiconductor packages	Huang-Kuang Kung;Bo-Wun Huang;Hsiang-Chen Hsu
義守大學	2010-08	Electromigration Analysis and Electro-Thermo-Mechanical Design for Package-on-Package (POP)	Hsiang-Chen Hsu;Shen-Wen Ju;Jie-Rong Lu;Yue-Min Wan
義守大學	2010-08	Reliability analysis on electromigration and electro-thermo-mechanical for Sn4.0Ag0.5Cu solder ball	Hsiang-Chen Hsu;Jie-Rong Lu;Yue-Min Wan;Shen-Li Fu
義守大學	2010-03	A Study on the Characteristic of the Ultra-Thin Copper Bonding Wire	Hsiang-Chen Hsu;Wei-Yao Chang
義守大學	2010	EHL of circular contacts lubricating with mixture of two lubricants	Li-Ming Chu;Wang-Long Li;Yuh-Ping Chang;Hsiang-Chen Hsu
義守大學	2009/10/21	Electro-thermo-mechanical design and electromigration analysis for Package-On-Package (POP)	Hsiang-Chen Hsu ; Shen-Wen Ju ; Jie-Rong Lu ; Shen-Li Fu
義守大學	2009/08/10	Advanced moisture diffusion model and hygro-thermo-mechanical design for flip chip BGA package	Ming-Han Tsai ; Feng-Jui Hsu ; Meng-Chieh Weng ; Hsiang-Chen Hsu
義守大學	2009/08/10	Electromigration analysis and electro-thermo-mechanical design for semiconductor package	Hsiang-Chen Hsu ; Shen-Wen Ju ; Jie-Rong Lu ; Hong-Shen Chang ; Hong-Hau Wu

Showing items 41-65 of 111 (5 Page(s) Totally)
<< < 1 2 3 4 5 > >>
View [10|25|50] records per page

	English \| 正體中文 \| 简体中文 \| Total items :2832440
	Visitors : 33806323 Online Users : 1453 Project Commissioned by the Ministry of Education Project Executed by National Taiwan University Library