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Date
Title
Author
義守大學
2011-06
Squeeze Film Characteristics of Circular Contacts at Constant Squeeze Velocity Motion with Non-Newtonian Lubricants
Li-Ming Chu;Wang-Long Li;Hsiang-Chen Hsu
義守大學
2011-06
Hygro-Thermo-Vapor Pressure Coupled Model on Premold QFN CMOS Image Sensor
Hsiang-Chen Hsu;Li-Ming Chu;Shen-Li Fu
義守大學
2011-05
Nanotribology Properties and Microscopic Interfacial Frictional Behavior Studied by Atomic Force Microscopy
Hsiang-Chen Hsu;Li-Ming Chu
義守大學
2011-01
Fabrication of Microfluidic Rapid Micromixer
Hsiang-Chen Hsu;Hsi-Chien Liu;Cheng-Jiun Han
義守大學
2011-01
Characteristic of copper wire and transient analysis on wirebonding process
Hsiang-Chen Hsu;Wei-Yao Chang;Chang-Lin Yeh;Yi-Shao Lai
義守大學
2010-12
Advanced Finite Element Model on Copper Wire Ball Bonding
Hsiang-Chen Hsu;Hong-Shen Chang;Shu-Chi Tsao;Shen-Li Fu
義守大學
2010-10
Thermal aging effect on copper wire and micro interfacial frictional behavior along Cu FAB and Al pad
Hsiang-Chen Hsu;Chih-Chiang Fu;Hong-Shen Chang;Shen-Li Fu;Huang-Kuang Kung
義守大學
2010-10
The effect of cross-section geometry of bonding wire on wire sweep for semiconductor packages
Huang-Kuang Kung;Bo-Wun Huang;Hsiang-Chen Hsu
義守大學
2010-08
Electromigration Analysis and Electro-Thermo-Mechanical Design for Package-on-Package (POP)
Hsiang-Chen Hsu;Shen-Wen Ju;Jie-Rong Lu;Yue-Min Wan
義守大學
2010-08
Reliability analysis on electromigration and electro-thermo-mechanical for Sn4.0Ag0.5Cu solder ball
Hsiang-Chen Hsu;Jie-Rong Lu;Yue-Min Wan;Shen-Li Fu
義守大學
2010-03
A Study on the Characteristic of the Ultra-Thin Copper Bonding Wire
Hsiang-Chen Hsu;Wei-Yao Chang
義守大學
2010
EHL of circular contacts lubricating with mixture of two lubricants
Li-Ming Chu;Wang-Long Li;Yuh-Ping Chang;Hsiang-Chen Hsu
義守大學
2009/10/21
Electro-thermo-mechanical design and electromigration analysis for Package-On-Package (POP)
Hsiang-Chen Hsu ; Shen-Wen Ju ; Jie-Rong Lu ; Shen-Li Fu
義守大學
2009/08/10
Advanced moisture diffusion model and hygro-thermo-mechanical design for flip chip BGA package
Ming-Han Tsai ; Feng-Jui Hsu ; Meng-Chieh Weng ; Hsiang-Chen Hsu
義守大學
2009/08/10
Electromigration analysis and electro-thermo-mechanical design for semiconductor package
Hsiang-Chen Hsu ; Shen-Wen Ju ; Jie-Rong Lu ; Hong-Shen Chang ; Hong-Hau Wu
義守大學
2009/04/11
Observation of transformation from quantum shuttle to single-electron tunnel in nanopillar transistor
Yue-Min Wan;Shiao-Yu Chen;Che-Min Yang;Chih-An Chen;Yi-Feng Chen;Hsiang-Chen Hsu
義守大學
2009-10
Electro-thermo-mechanical design and electromigration analysis for Package-On-Package (POP)
Hsiang-Chen Hsu; Shen-Wen Ju; Jie-Rong Lu; Shen-Li Fu;
義守大學
2009-10
Dynamic Analysis on Underlay Microstructure for Cu/Low-k Wafer during Wire Bonding
Hsiang-Chen Hsu;Pei-Chieh Chin;Chin-Yuan Hu;Wei-Yao Chang;Chang-Lin Yeh;Yi-Shao Lai
義守大學
2009-10
Comprehensive Hygro-Thermo-Vapor Pressure Model for CMOS Image Sensor
Hsiang-Chen Hsu;Li-Ming Chu;Lih-Shan Chen;Shen-Li Fu
義守大學
2009-10
The experimental measurement of wire sag of long wire bonds for 3-dimensional and multi-chip module packaging
Huang-Kuang Kung;Hong-Shong Chen;Jwo-Ming Jou;Hsiang-Chen Hsu
義守大學
2009-08
Inverse approach for calculating temperature in EHL of line contacts
Li-Ming Chu;Hsiang-Chen Hsu;Jaw-Ren Lin;Yuh-Ping Chang
義守大學
2009-04
Observation of Transformation from Quantum Shuttle to Single-Electron Tunnel in Nanopillar Transistor
Yue-Min Wan;Shiao-Yu Chen;Che-Min Yang;Chih-An Chen;Yi-Feng Chen;Hsiang-Chen Hsu
義守大學
2009-02
Magneto-elastohydrodynamic lubrication of circular contacts at impact loading
Li-Ming Chu;Wang-Long Li;Hsiang-Chen Hsu;Yuh-Ping Chang
義守大學
2008/12/09
Characteristic of Heat Affected Zone for Ultra Thin Gold Wire/Copper Wire and Advanced Finite Element Wirebonding Model
Wei-Yao Chang ; Hsiang-Chen Hsu ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學
2008/10/22
Hygroscopic Swelling Effect on Polymeric Materials and Thermo-hygro-mechanical Design on Finger Printer Package
Hsiang-Chen Hsu;Yu-Teng Hsu ; Wen-Lo Hsich ; Meng-Chieh Weng ; Shao-Tang ZhangJian ; Feng-Jui Hsu ; Yi-Feng Chen ; Shen-Li Fu
Showing items 51-75 of 111 (5 Page(s) Totally)
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