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Showing items 51-75 of 111  (5 Page(s) Totally)
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Institution Date Title Author
義守大學 2011-06 Squeeze Film Characteristics of Circular Contacts at Constant Squeeze Velocity Motion with Non-Newtonian Lubricants Li-Ming Chu;Wang-Long Li;Hsiang-Chen Hsu
義守大學 2011-06 Hygro-Thermo-Vapor Pressure Coupled Model on Premold QFN CMOS Image Sensor Hsiang-Chen Hsu;Li-Ming Chu;Shen-Li Fu
義守大學 2011-05 Nanotribology Properties and Microscopic Interfacial Frictional Behavior Studied by Atomic Force Microscopy Hsiang-Chen Hsu;Li-Ming Chu
義守大學 2011-01 Fabrication of Microfluidic Rapid Micromixer Hsiang-Chen Hsu;Hsi-Chien Liu;Cheng-Jiun Han
義守大學 2011-01 Characteristic of copper wire and transient analysis on wirebonding process Hsiang-Chen Hsu;Wei-Yao Chang;Chang-Lin Yeh;Yi-Shao Lai
義守大學 2010-12 Advanced Finite Element Model on Copper Wire Ball Bonding Hsiang-Chen Hsu;Hong-Shen Chang;Shu-Chi Tsao;Shen-Li Fu
義守大學 2010-10 Thermal aging effect on copper wire and micro interfacial frictional behavior along Cu FAB and Al pad Hsiang-Chen Hsu;Chih-Chiang Fu;Hong-Shen Chang;Shen-Li Fu;Huang-Kuang Kung
義守大學 2010-10 The effect of cross-section geometry of bonding wire on wire sweep for semiconductor packages Huang-Kuang Kung;Bo-Wun Huang;Hsiang-Chen Hsu
義守大學 2010-08 Electromigration Analysis and Electro-Thermo-Mechanical Design for Package-on-Package (POP) Hsiang-Chen Hsu;Shen-Wen Ju;Jie-Rong Lu;Yue-Min Wan
義守大學 2010-08 Reliability analysis on electromigration and electro-thermo-mechanical for Sn4.0Ag0.5Cu solder ball Hsiang-Chen Hsu;Jie-Rong Lu;Yue-Min Wan;Shen-Li Fu
義守大學 2010-03 A Study on the Characteristic of the Ultra-Thin Copper Bonding Wire Hsiang-Chen Hsu;Wei-Yao Chang
義守大學 2010 EHL of circular contacts lubricating with mixture of two lubricants Li-Ming Chu;Wang-Long Li;Yuh-Ping Chang;Hsiang-Chen Hsu
義守大學 2009/10/21 Electro-thermo-mechanical design and electromigration analysis for Package-On-Package (POP) Hsiang-Chen Hsu ; Shen-Wen Ju ; Jie-Rong Lu ; Shen-Li Fu
義守大學 2009/08/10 Advanced moisture diffusion model and hygro-thermo-mechanical design for flip chip BGA package Ming-Han Tsai ; Feng-Jui Hsu ; Meng-Chieh Weng ; Hsiang-Chen Hsu
義守大學 2009/08/10 Electromigration analysis and electro-thermo-mechanical design for semiconductor package Hsiang-Chen Hsu ; Shen-Wen Ju ; Jie-Rong Lu ; Hong-Shen Chang ; Hong-Hau Wu
義守大學 2009/04/11 Observation of transformation from quantum shuttle to single-electron tunnel in nanopillar transistor Yue-Min Wan;Shiao-Yu Chen;Che-Min Yang;Chih-An Chen;Yi-Feng Chen;Hsiang-Chen Hsu
義守大學 2009-10 Electro-thermo-mechanical design and electromigration analysis for Package-On-Package (POP) Hsiang-Chen Hsu; Shen-Wen Ju; Jie-Rong Lu; Shen-Li Fu;
義守大學 2009-10 Dynamic Analysis on Underlay Microstructure for Cu/Low-k Wafer during Wire Bonding Hsiang-Chen Hsu;Pei-Chieh Chin;Chin-Yuan Hu;Wei-Yao Chang;Chang-Lin Yeh;Yi-Shao Lai
義守大學 2009-10 Comprehensive Hygro-Thermo-Vapor Pressure Model for CMOS Image Sensor Hsiang-Chen Hsu;Li-Ming Chu;Lih-Shan Chen;Shen-Li Fu
義守大學 2009-10 The experimental measurement of wire sag of long wire bonds for 3-dimensional and multi-chip module packaging Huang-Kuang Kung;Hong-Shong Chen;Jwo-Ming Jou;Hsiang-Chen Hsu
義守大學 2009-08 Inverse approach for calculating temperature in EHL of line contacts Li-Ming Chu;Hsiang-Chen Hsu;Jaw-Ren Lin;Yuh-Ping Chang
義守大學 2009-04 Observation of Transformation from Quantum Shuttle to Single-Electron Tunnel in Nanopillar Transistor Yue-Min Wan;Shiao-Yu Chen;Che-Min Yang;Chih-An Chen;Yi-Feng Chen;Hsiang-Chen Hsu
義守大學 2009-02 Magneto-elastohydrodynamic lubrication of circular contacts at impact loading Li-Ming Chu;Wang-Long Li;Hsiang-Chen Hsu;Yuh-Ping Chang
義守大學 2008/12/09 Characteristic of Heat Affected Zone for Ultra Thin Gold Wire/Copper Wire and Advanced Finite Element Wirebonding Model Wei-Yao Chang ; Hsiang-Chen Hsu ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學 2008/10/22 Hygroscopic Swelling Effect on Polymeric Materials and Thermo-hygro-mechanical Design on Finger Printer Package Hsiang-Chen Hsu;Yu-Teng Hsu ; Wen-Lo Hsich ; Meng-Chieh Weng ; Shao-Tang ZhangJian ; Feng-Jui Hsu ; Yi-Feng Chen ; Shen-Li Fu

Showing items 51-75 of 111  (5 Page(s) Totally)
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