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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Showing items 11-35 of 111  (5 Page(s) Totally)
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Institution Date Title Author
義守大學 2016-12 Effects of Surface Forces on Squeeze EHL Motion between Elastic Ball and Elastic Coated Surface Li-Ming Chu;Jaw-Ren Lin;Hsiang-Chen Hsu;Yuh-Ping Chang
義守大學 2016-10 Reduction of Residual Stresses in Sapphire Cover Glass Induced by Mechanical Polishing and Laser Chamfering Through Etching Shih-Jeh Wu;Hsiang-Chen Hsu;Wen-Fei Lin
義守大學 2016-09 Squeeze film characteristics of circular contacts at impact and rebound motion with micropolar lubricants Li-Ming Chu;Jaw-Ren Lin;Yuh-Ping Chang;Hsiang-Chen Hsu
義守大學 2016-09 An investigation on micro-via drilling on ceramic substrates by a picosecond laser Hsiang-Chen Hsu;Shih-Jeh Wu
義守大學 2016-07 The Application of General Homotopy Method on Planar Four-Bar Path Synthesis Pei-chieh Chin;Hsiang-chen Hsu;Shen-li Fu
義守大學 2016-04 Through Mold Via (TMV) by gas-aided laser Hsiang-Chen Hsu;Shih-Jeh Wu;Wen-Fei Lin;Chi-Shiung Hsi;Hsing-Yi Pao;Pin-Chieh Wang
義守大學 2016-04 Reliability design on wearable device for initial osteoarthritis (OA) on knee joints Hsiang-Chen Hsu;Pin-Chieh Wang;Jia-Jung Wang;Shen-Li Fu
義守大學 2015-12 Power Law Fluid Model Incorporated into Thin Film Elastohydrodynamic Lubrication of Circular Contacts Li-Ming Chu;Hsiang-Chen Hsu;Chia-Hsiang Su
義守大學 2015-06 Design on MEMS-based 3D biochip for drug-released dispenser Hsiang-Chen Hsu;Li-Ming Chu;Baojun Liu;Chien-Yuan Lai
義守大學 2015-05 A Layered-Rheology Model for Thin Film Elastohydrodynamic Lubrication of Circular Contacts Li-Ming Chu;Hsiang-Chen Hsu
義守大學 2015-04 Internal patterning of the glass backlight module for LCD panel by laser Shih-Jeh Wu;Hsiang-Chen Hsu;Pin-Chieh Wang;Shen-Li Fu
義守大學 2014-12 An investigation on dicing 28-nm node Cu/low-k wafer with a Picosecond Pulse Laser Hsiang-Chen Hsu;Li-Ming Chu;Baojun Liu;Chih-Chiang Fu
義守大學 2014-10 Laser Grooving Technique for Dicing Nanoscale Low-k Wafer Hsiang-Chen Hsu
義守大學 2014-10 An experimental study on dicing 28 nm low-k water using laser grooving technique Hsiang-Chen Hsu;Cheng-Jiun Han;Li-Ming Chu;Shih-Jeh Wu;Chih-Chiang Fu;Shen-Li Fu;Baojun Liu;Chen-Yi Wang;PoChun Jung
義守大學 2014-10 Cutting PCB with a 532nm DPSS green laser Hsiang-Chen Hsu;Shih-Jeh Wu;Chih-Chiang Fu;Li-Ming Chu;Shen-Li Fu;Trong-Tai Nguyen
義守大學 2014-09 Novel design and fabrication of a geometrical obstacle-embedded micromixer with notched wall Shih-Jeh Wu;Hsiang-Chen Hsu;Wen-Jui Feng
義守大學 2014-06 Laser drilling and thermal stress analysis on TSV in 3D IC structure Hsiang-Chen Hsu;Shih-Jeh Wu
義守大學 2014-03 Numerical simulation of high power LED heat-dissipating system Shih-Jeh Wu;Hsiang-Chen Hsu;Shen-Li Fu;Jiam-Nan Yeh
義守大學 2014-01 Reliability and Bondability Study on Interfacial Behavior between SnAgCu Solder and Cu-Ni-Au OSP Pads Shen-Li Fu;Hsiang-Chen Hsu;Yue-Min Wan;Chi-Hau Haung
義守大學 2014-01 An Analytical Approach for Analysis of Slider Bearings with Non-Newtonian Lubricants Li-Ming Chu;Hsiang-Chen Hsu;Jiann-Lin Chen
義守大學 2013-10 Thermal design for high power arrayed LED heat-dissipating system Hsiang-Chen Hsu;Shih-Jeh Wu;Jyun-Yi Li;Jing-Wen Su;Jian-Siang Huang;Shen-Li Fu
義守大學 2013-10 Electrochemical migration failure on FR-4 PCB by hygro-thermo-vapor pressure coupled analysis Hsiang-Chen Hsu;Shih-Jeh Wu;Feng-Jui Hsu;Meng-Chieh Weng;Shen-Li Fu
義守大學 2013-10 An investigation on nanoscale bondability between Cu-Al intermetallic compound Hsiang-Chen Hsu;Jih-Hsin Chien;Chen-Yi Wang;Li-Ming Chu;Shin-Pon Ju;Shen-Li Fu;Miin Shyan Bai
義守大學 2013-09 Further characterization of Pd-coated copper wire on wirebonding process: from a nanoscale perspective Hsiang-Chen Hsu;Li-Ming Chu;Wei-Yao Chang;Yi-Feng Chen;Jih-Hsin Chien;Shen-Li Fu;Shin-Pon Ju;Wen-Jui Feng
義守大學 2013-04 Effects of Surface Roughness and Flow Rheology on the EHL of Circular Contacts with Power-Law Fluid Li-Ming Chu;Jaw-Ren Lin;Hsiang-Chen Hsu;Yuh-Ping Chang

Showing items 11-35 of 111  (5 Page(s) Totally)
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