臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	Repositories
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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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Institution	Date	Title	Author
義守大學	2006-08	A Novel Submodeling Scheme on Thermal Cycle Test for CMOS Image Sensor	Hsiang-Chen Hsu; Hui-Yu Lee; Yu-Chia Hsu; Chin-Yuan Hu; Ming-Jer Lin; Pei-Chieh Chin; Shen-Li Fu; Chung, M.C.L.; Ching-Chung Tseng
義守大學	2006-08	Parametric Study and Optimal Design in Wire Bonding Process for Mini Stack-Die Package	Hsiang-Chen Hsu;Shen-Wen Yu;Yu-Teng Hsu;Wei-Yaw Chang;Ming-Jer Lin;Ruei-Ming Lin;Pei-Chieh Chin;Hung-Chun Ho;Ming-Cheng Lu;Cheng-Tung Lee;Chin-Liang Chen;Chien-Hung Liao;Yu-Jung Huang;Shen-Li Fu;Li-Shan Chen
義守大學	2006	Reliability prediction for 95.5Sn3.9Ag0.6Cu solder bump and thermal design for lead free system in package with polymer-based material	Hsiang-Chen Hsu;Wei-Mao Hung
義守大學	2005-12	Reliability and thermal structure design for CMOS image sensor	Hsiang-Chen Hsu; Hui-Yu Lee; Yu-Chia Hsu; Shen-Li Fu; Chung-Chi Yang; Kuan-Chieh Huang
義守大學	2002/12/04	Thermal design and reliability of convenable MultiChip Module package on HDIIVH substrates	Hsiang-Chen Hsu ; Lih-Shan Chen ; Lee-Wei Chu
義守大學	2002	Thermal design and reliability of convenable MultiChip Module package on HDIIVH substrates	Hsiang-Chen Hsu; Lih-Shan Chen; Lee-Wei Chu

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