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機構	日期	題名	作者
義守大學	2012-03	Effects of Electric Double Layer on Pure Squeeze Motion of Circular Contacts – An Elastohydrodynamic Lubrication Model	Li-Ming Chu;Wang-Long Li;Hsiang-Chen Hsu;Jung-Shun Tsai
義守大學	2012-03	An Innovative Approach to Fiber-To-The-Home (FTTH)	Hsiang-Chen Hsu;Don Liu;Shu-Sen Tieh;Chun-Hsien Kuo
義守大學	2011-10	Nonlinear Analysis of Porous Squeeze Film Damper-Mounted a Rotor with Non-Linear Suspension and Roughness Effect	Cai-Wan Chang-jian;Hsiang-Chen Hsu;Jiann-Lin Chen;Guan-I Wu
義守大學	2011-10	An investigation of temperature influence on the SAC305 soldering on Cu-Ni-Au substrate	Hsiang-Chen Hsu;Yu-Ming Wan;Chi-Hau Haung;Shen-Li Fu
義守大學	2011-10	A study on Nano-mechanical properties and nano-tribology for ultra-thin Pt-coated 4N copper wire	Hsiang-Chen Hsu;Jih-Hsin Chien;Shen-Li Fu
義守大學	2011-06	Squeeze Film Characteristics of Circular Contacts at Constant Squeeze Velocity Motion with Non-Newtonian Lubricants	Li-Ming Chu;Wang-Long Li;Hsiang-Chen Hsu
義守大學	2011-06	Hygro-Thermo-Vapor Pressure Coupled Model on Premold QFN CMOS Image Sensor	Hsiang-Chen Hsu;Li-Ming Chu;Shen-Li Fu
義守大學	2011-05	Nanotribology Properties and Microscopic Interfacial Frictional Behavior Studied by Atomic Force Microscopy	Hsiang-Chen Hsu;Li-Ming Chu
義守大學	2011-01	Fabrication of Microfluidic Rapid Micromixer	Hsiang-Chen Hsu;Hsi-Chien Liu;Cheng-Jiun Han
義守大學	2011-01	Characteristic of copper wire and transient analysis on wirebonding process	Hsiang-Chen Hsu;Wei-Yao Chang;Chang-Lin Yeh;Yi-Shao Lai
義守大學	2010-12	Advanced Finite Element Model on Copper Wire Ball Bonding	Hsiang-Chen Hsu;Hong-Shen Chang;Shu-Chi Tsao;Shen-Li Fu
義守大學	2010-10	Thermal aging effect on copper wire and micro interfacial frictional behavior along Cu FAB and Al pad	Hsiang-Chen Hsu;Chih-Chiang Fu;Hong-Shen Chang;Shen-Li Fu;Huang-Kuang Kung
義守大學	2010-10	The effect of cross-section geometry of bonding wire on wire sweep for semiconductor packages	Huang-Kuang Kung;Bo-Wun Huang;Hsiang-Chen Hsu
義守大學	2010-08	Electromigration Analysis and Electro-Thermo-Mechanical Design for Package-on-Package (POP)	Hsiang-Chen Hsu;Shen-Wen Ju;Jie-Rong Lu;Yue-Min Wan
義守大學	2010-08	Reliability analysis on electromigration and electro-thermo-mechanical for Sn4.0Ag0.5Cu solder ball	Hsiang-Chen Hsu;Jie-Rong Lu;Yue-Min Wan;Shen-Li Fu
義守大學	2010-03	A Study on the Characteristic of the Ultra-Thin Copper Bonding Wire	Hsiang-Chen Hsu;Wei-Yao Chang
義守大學	2010	EHL of circular contacts lubricating with mixture of two lubricants	Li-Ming Chu;Wang-Long Li;Yuh-Ping Chang;Hsiang-Chen Hsu
義守大學	2009/10/21	Electro-thermo-mechanical design and electromigration analysis for Package-On-Package (POP)	Hsiang-Chen Hsu ; Shen-Wen Ju ; Jie-Rong Lu ; Shen-Li Fu
義守大學	2009/08/10	Advanced moisture diffusion model and hygro-thermo-mechanical design for flip chip BGA package	Ming-Han Tsai ; Feng-Jui Hsu ; Meng-Chieh Weng ; Hsiang-Chen Hsu
義守大學	2009/08/10	Electromigration analysis and electro-thermo-mechanical design for semiconductor package	Hsiang-Chen Hsu ; Shen-Wen Ju ; Jie-Rong Lu ; Hong-Shen Chang ; Hong-Hau Wu
義守大學	2009/04/11	Observation of transformation from quantum shuttle to single-electron tunnel in nanopillar transistor	Yue-Min Wan;Shiao-Yu Chen;Che-Min Yang;Chih-An Chen;Yi-Feng Chen;Hsiang-Chen Hsu
義守大學	2009-10	Electro-thermo-mechanical design and electromigration analysis for Package-On-Package (POP)	Hsiang-Chen Hsu; Shen-Wen Ju; Jie-Rong Lu; Shen-Li Fu;
義守大學	2009-10	Dynamic Analysis on Underlay Microstructure for Cu/Low-k Wafer during Wire Bonding	Hsiang-Chen Hsu;Pei-Chieh Chin;Chin-Yuan Hu;Wei-Yao Chang;Chang-Lin Yeh;Yi-Shao Lai
義守大學	2009-10	Comprehensive Hygro-Thermo-Vapor Pressure Model for CMOS Image Sensor	Hsiang-Chen Hsu;Li-Ming Chu;Lih-Shan Chen;Shen-Li Fu
義守大學	2009-10	The experimental measurement of wire sag of long wire bonds for 3-dimensional and multi-chip module packaging	Huang-Kuang Kung;Hong-Shong Chen;Jwo-Ming Jou;Hsiang-Chen Hsu

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