臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	Repositories
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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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Institution	Date	Title	Author
義守大學	2010-12	Advanced Finite Element Model on Copper Wire Ball Bonding	Hsiang-Chen Hsu;Hong-Shen Chang;Shu-Chi Tsao;Shen-Li Fu
義守大學	2010-10	Thermal aging effect on copper wire and micro interfacial frictional behavior along Cu FAB and Al pad	Hsiang-Chen Hsu;Chih-Chiang Fu;Hong-Shen Chang;Shen-Li Fu;Huang-Kuang Kung
義守大學	2010-10	The effect of cross-section geometry of bonding wire on wire sweep for semiconductor packages	Huang-Kuang Kung;Bo-Wun Huang;Hsiang-Chen Hsu
義守大學	2010-08	Electromigration Analysis and Electro-Thermo-Mechanical Design for Package-on-Package (POP)	Hsiang-Chen Hsu;Shen-Wen Ju;Jie-Rong Lu;Yue-Min Wan
義守大學	2010-08	Reliability analysis on electromigration and electro-thermo-mechanical for Sn4.0Ag0.5Cu solder ball	Hsiang-Chen Hsu;Jie-Rong Lu;Yue-Min Wan;Shen-Li Fu
義守大學	2010-03	A Study on the Characteristic of the Ultra-Thin Copper Bonding Wire	Hsiang-Chen Hsu;Wei-Yao Chang
義守大學	2010	EHL of circular contacts lubricating with mixture of two lubricants	Li-Ming Chu;Wang-Long Li;Yuh-Ping Chang;Hsiang-Chen Hsu
義守大學	2009/10/21	Electro-thermo-mechanical design and electromigration analysis for Package-On-Package (POP)	Hsiang-Chen Hsu ; Shen-Wen Ju ; Jie-Rong Lu ; Shen-Li Fu
義守大學	2009/08/10	Advanced moisture diffusion model and hygro-thermo-mechanical design for flip chip BGA package	Ming-Han Tsai ; Feng-Jui Hsu ; Meng-Chieh Weng ; Hsiang-Chen Hsu
義守大學	2009/08/10	Electromigration analysis and electro-thermo-mechanical design for semiconductor package	Hsiang-Chen Hsu ; Shen-Wen Ju ; Jie-Rong Lu ; Hong-Shen Chang ; Hong-Hau Wu
義守大學	2009/04/11	Observation of transformation from quantum shuttle to single-electron tunnel in nanopillar transistor	Yue-Min Wan;Shiao-Yu Chen;Che-Min Yang;Chih-An Chen;Yi-Feng Chen;Hsiang-Chen Hsu
義守大學	2009-10	Electro-thermo-mechanical design and electromigration analysis for Package-On-Package (POP)	Hsiang-Chen Hsu; Shen-Wen Ju; Jie-Rong Lu; Shen-Li Fu;
義守大學	2009-10	Dynamic Analysis on Underlay Microstructure for Cu/Low-k Wafer during Wire Bonding	Hsiang-Chen Hsu;Pei-Chieh Chin;Chin-Yuan Hu;Wei-Yao Chang;Chang-Lin Yeh;Yi-Shao Lai
義守大學	2009-10	Comprehensive Hygro-Thermo-Vapor Pressure Model for CMOS Image Sensor	Hsiang-Chen Hsu;Li-Ming Chu;Lih-Shan Chen;Shen-Li Fu
義守大學	2009-10	The experimental measurement of wire sag of long wire bonds for 3-dimensional and multi-chip module packaging	Huang-Kuang Kung;Hong-Shong Chen;Jwo-Ming Jou;Hsiang-Chen Hsu
義守大學	2009-08	Inverse approach for calculating temperature in EHL of line contacts	Li-Ming Chu;Hsiang-Chen Hsu;Jaw-Ren Lin;Yuh-Ping Chang
義守大學	2009-04	Observation of Transformation from Quantum Shuttle to Single-Electron Tunnel in Nanopillar Transistor	Yue-Min Wan;Shiao-Yu Chen;Che-Min Yang;Chih-An Chen;Yi-Feng Chen;Hsiang-Chen Hsu
義守大學	2009-02	Magneto-elastohydrodynamic lubrication of circular contacts at impact loading	Li-Ming Chu;Wang-Long Li;Hsiang-Chen Hsu;Yuh-Ping Chang
義守大學	2008/12/09	Characteristic of Heat Affected Zone for Ultra Thin Gold Wire/Copper Wire and Advanced Finite Element Wirebonding Model	Wei-Yao Chang ; Hsiang-Chen Hsu ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學	2008/10/22	Hygroscopic Swelling Effect on Polymeric Materials and Thermo-hygro-mechanical Design on Finger Printer Package	Hsiang-Chen Hsu;Yu-Teng Hsu ; Wen-Lo Hsich ; Meng-Chieh Weng ; Shao-Tang ZhangJian ; Feng-Jui Hsu ; Yi-Feng Chen ; Shen-Li Fu
義守大學	2008/10/22	Fabrication and characterization of passive devices on flexible substrates	Pei-Ju Lin ; Hung-Ming Chang ; Ching-Chien Yuan ; Yu-Jung Huang ; Lih-Shan Chen ; Hsiang-Chen Hsu ; Shen-Li Fu
義守大學	2008/10/22	An Investigation on Heat Affected Zone for Au Wire/Cu Wire and Advanced Finite Element Wirebonding Model	Wei-Yao Chang ; Hsiang-Chen Hsu ; Shen-Li Fu ; Yi-Shao Lai ; Chang-Lin Yeh
義守大學	2008/01/24	Experimental approach to analyze failure site condition in final testing of bga package	Hsiang-Chen Hsu;Ming-Kun Chen;Yu-Jung Huang;Shen-Li Fu
義守大學	2008/01/06	Vibrations and mechanically-induced currents in nanopillars transistor	Yue-Min Wan ; Shiao-Yu Chen ; Hein-Tien Lin ; Chih-An Chen ; Hsiang-Chen Hsu
義守大學	2008-12	Characteristic of Heat Affected Zone for Ultra Thin Gold Wire/Copper Wire and Advanced Finite Element Wirebonding Model	Wei-Yao Chang; Hsiang-Chen Hsu; Shen-Li Fu; Chang-Lin Yeh; Yi-Shao Lai

Showing items 56-80 of 111 (5 Page(s) Totally)
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