臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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Institution	Date	Title	Author
義守大學	2008/10/22	Fabrication and characterization of passive devices on flexible substrates	Pei-Ju Lin ; Hung-Ming Chang ; Ching-Chien Yuan ; Yu-Jung Huang ; Lih-Shan Chen ; Hsiang-Chen Hsu ; Shen-Li Fu
義守大學	2008/10/22	An Investigation on Heat Affected Zone for Au Wire/Cu Wire and Advanced Finite Element Wirebonding Model	Wei-Yao Chang ; Hsiang-Chen Hsu ; Shen-Li Fu ; Yi-Shao Lai ; Chang-Lin Yeh
義守大學	2008/01/24	Experimental approach to analyze failure site condition in final testing of bga package	Hsiang-Chen Hsu;Ming-Kun Chen;Yu-Jung Huang;Shen-Li Fu
義守大學	2008/01/06	Vibrations and mechanically-induced currents in nanopillars transistor	Yue-Min Wan ; Shiao-Yu Chen ; Hein-Tien Lin ; Chih-An Chen ; Hsiang-Chen Hsu
義守大學	2008-12	Characteristic of Heat Affected Zone for Ultra Thin Gold Wire/Copper Wire and Advanced Finite Element Wirebonding Model	Wei-Yao Chang; Hsiang-Chen Hsu; Shen-Li Fu; Chang-Lin Yeh; Yi-Shao Lai
義守大學	2008-11	Effect of oxide additives on the low-temperature sintering of dielectrics (Zn,Mg)TiO3	Ming-Liang Hsieh;Lih-Shan Chen;Hsiang-Chen Hsu;Shuming Wang;Mau-Phon Houng;Shen-Li Fu
義守大學	2008-10	Fabrication and characterization of passive devices on flexible substrates	Pei-Ju Lin;Hung-Ming Chang;Ching-Chien Yuan;Yu-Jung Huang;Lih-Shan Chen;Hsiang-Chen Hsu;Shen-Li Fu
義守大學	2008-10	Thermo-hygro-mechanical design and reliability analysis for CMOS image sensor	Hsiang-Chen Hsu;Hui-Yu Lee;Yu-Cha Hsu;Shen-Li Fu
義守大學	2008-08	Finite Element Prediction of Stack-Die Packages under Board Level Drop Test	Hsiang-Chen Hsu;Yu-Chia Hsu;Chan-Lin Yeh;Yi-Shao Lai
義守大學	2008-08	Reliability of SnAgCu Alloys for CMOS Image Sensor QFN Package under Thermal Cycling Loading	Hsiang-Chen Hsu;Hui-Yu Lee;Wen-Lo Shieh
義守大學	2008-07	Low temperature sinterable (Zn,Mg)TiO3 microwave dielectrics	Lih-Shan Chen;Ming-Liang Hsieh;Hsiang-Chen Hsu;Shen-Li Fu
義守大學	2008-07	Low temperature sinterable (Zn,Mg)TiO3 microwave dielectrics	Lih-Shan Chen;Ming-Liang Hsieh;Hsiang-Chen Hsu;Shen-Li Fu
義守大學	2008-04	Simulation and experimental measurement of flow field within four-stroke motorcycle engines	Li-Ming Chu;Min-Hsing Chang;Hsiang-Chen Hsu;Wen-Tung Chien;Chien-Heng Liu; 朱力民;張敏興;徐祥禎;簡文通;劉建亨
義守大學	2008-01	Vibrations and mechanically-induced currents in nanopillars transistor	Yue-Min Wan; Shiao-Yu Chen; Hein-Tien Lin; Chih-An Chen; Hsiang-Chen Hsu
義守大學	2008-01	Elastohydrodynamic lubrication of circular contacts at impact loading with generalized newtonian lubricants	Hsiao-Ming Chu;Jiann-Lin Chen; Hsiang-Chen Hsu;Wang-Long Li
義守大學	2008-01	Vibrations and mechanically-induced currents in nanopillars transistor	Yue-Min Wan;Shiao-Yu Chen;Hein-Tien Lin;Chih-An Chen;Hsiang-Chen Hsu
義守大學	2008	Thermo-hygro-mechanical design and reliability analysis for CMOS Image Sensor	Hsiang-Chen Hsu;Hui-Yu Lee;Yu-Cha Hsu;Shen-Li Fu
義守大學	2008	An Investigation on Heat Affected Zone for Au Wire/Cu Wire and Advanced Finite Element Wirebonding Model	Wei-Yao Chang; Hsiang-Chen Hsu; Shen-Li Fu; Yi-Shao Lai; Chang-Lin Yeh
義守大學	2008	Hygroscopic Swelling Effect on Polymeric Materials and Thermo-hygro-mechanical Design on Finger Printer Package	Hsiang-Chen Hsu; Yu-Teng Hsu; Wen-Lo Hsich; Meng-Chieh Weng; Shao-Tang ZhangJian; Feng-Jui Hsu; Yi-Feng Chen; Shen-Li Fu
義守大學	2007/11/19	Dynamic finite element analysis on underlay microstructure of Cu/low-K wafer during bonding process	Hsiang-Chen Hsu ; Wei-Yaw Chang ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學	2007/10/01	Characteristic of heat affected zone in thin gold wire and dynamic transient analysis of wire bonding for microstructure of Cu/Low-K wafer	Pei-Chieh Chin ; Chin-Yuan Hu ; Hsiang-Chen Hsu ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學	2007-12	Thermal-Hygro-Mechanical Design for CMOS Image Sensor	Hsiang-Chen Hsu;Hui-Yu Lee;Yu-Cha Hsu
義守大學	2007-11	Dynamic finite element analysis on underlay microstructure of Cu/low-K wafer during bonding process	Hsiang-Chen Hsu; Wei-Yaw Chang; Shen-Li Fu; Chang-Lin Yeh; Yi-Shao Lai
義守大學	2007-10	Bondability Study and Correlation of Capillary Enhanced Profile with NiPdAu Pre-Plating Frame	Hsiang-Chen Hsu;Jerry HS Cheng;Chun-Da Lee;Wen-Lo Shieh
義守大學	2007	Characteristic of heat affected zone in thin gold wire and dynamic transient analysis of wire bonding for microstructure of Cu/Low-K wafer	Pei-Chieh Chin; Chin-Yuan Hu; Hsiang-Chen Hsu; Shen-Li Fu; Chang-Lin Yeh; Yi-Shao Lai

Showing items 76-100 of 111 (5 Page(s) Totally)
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