臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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Institution	Date	Title	Author
義守大學	2008-01	Vibrations and mechanically-induced currents in nanopillars transistor	Yue-Min Wan;Shiao-Yu Chen;Hein-Tien Lin;Chih-An Chen;Hsiang-Chen Hsu
義守大學	2008	Thermo-hygro-mechanical design and reliability analysis for CMOS Image Sensor	Hsiang-Chen Hsu;Hui-Yu Lee;Yu-Cha Hsu;Shen-Li Fu
義守大學	2008	An Investigation on Heat Affected Zone for Au Wire/Cu Wire and Advanced Finite Element Wirebonding Model	Wei-Yao Chang; Hsiang-Chen Hsu; Shen-Li Fu; Yi-Shao Lai; Chang-Lin Yeh
義守大學	2008	Hygroscopic Swelling Effect on Polymeric Materials and Thermo-hygro-mechanical Design on Finger Printer Package	Hsiang-Chen Hsu; Yu-Teng Hsu; Wen-Lo Hsich; Meng-Chieh Weng; Shao-Tang ZhangJian; Feng-Jui Hsu; Yi-Feng Chen; Shen-Li Fu
義守大學	2007/11/19	Dynamic finite element analysis on underlay microstructure of Cu/low-K wafer during bonding process	Hsiang-Chen Hsu ; Wei-Yaw Chang ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學	2007/10/01	Characteristic of heat affected zone in thin gold wire and dynamic transient analysis of wire bonding for microstructure of Cu/Low-K wafer	Pei-Chieh Chin ; Chin-Yuan Hu ; Hsiang-Chen Hsu ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學	2007-12	Thermal-Hygro-Mechanical Design for CMOS Image Sensor	Hsiang-Chen Hsu;Hui-Yu Lee;Yu-Cha Hsu
義守大學	2007-11	Dynamic finite element analysis on underlay microstructure of Cu/low-K wafer during bonding process	Hsiang-Chen Hsu; Wei-Yaw Chang; Shen-Li Fu; Chang-Lin Yeh; Yi-Shao Lai
義守大學	2007-10	Bondability Study and Correlation of Capillary Enhanced Profile with NiPdAu Pre-Plating Frame	Hsiang-Chen Hsu;Jerry HS Cheng;Chun-Da Lee;Wen-Lo Shieh
義守大學	2007	Characteristic of heat affected zone in thin gold wire and dynamic transient analysis of wire bonding for microstructure of Cu/Low-K wafer	Pei-Chieh Chin; Chin-Yuan Hu; Hsiang-Chen Hsu; Shen-Li Fu; Chang-Lin Yeh; Yi-Shao Lai
義守大學	2006/12/11	Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique	Hsiang-Chen Hsu ; Yu-Chia Hsu ; Hm-Yu Lee ; Chang-Lin Yeh ; Yi-Shao Lai ; Shen-Li Fu
義守大學	2006/12/06	Application of submodeling technique to transient drop impact analysis of board-level stacked die packages	Hsiang-Chen Hsu ; Yu-Chia Hsu ; Hui-Yu Lee ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學	2006/08/26	Parametric Study and Optimal Design in Wire Bonding Process for Mini Stack-Die Package	Hsiang-Chen Hsu ; Shen-Wen Yu ; Yu-Teng Hsu ; Wei-Yaw Chang ; Ming-Jer Lin ; Ruei-Ming Lin ; Pei-Chieh Chin ; Hung-Chun Ho ; Ming-Cheng Lu ; Cheng-Tung Lee ; Chin-Liang Chen ; Chien-Hung Liao ; Yu-Jung Huang ; Shen-Li Fu ; Li-Shan Chen
義守大學	2006/08/26	A Novel Submodeling Scheme on Thermal Cycle Test for CMOS Image Sensor	Hsiang-Chen Hsu ; Hui-Yu Lee ; Yu-Chia Hsu ; Chin-Yuan Hu ; Ming-Jer Lin ; Pei-Chieh Chin ; Shen-Li Fu ; Chung, M.C.L. ; Ching-Chung Tseng
義守大學	2006-12	Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique	Hsiang-Chen Hsu; Yu-Chia Hsu; Hm-Yu Lee; Chang-Lin Yeh; Yi-Shao Lai; Shen-Li Fu
義守大學	2006-08	A Novel Submodeling Scheme on Thermal Cycle Test for CMOS Image Sensor	Hsiang-Chen Hsu; Hui-Yu Lee; Yu-Chia Hsu; Chin-Yuan Hu; Ming-Jer Lin; Pei-Chieh Chin; Shen-Li Fu; Chung, M.C.L.; Ching-Chung Tseng
義守大學	2006-08	Parametric Study and Optimal Design in Wire Bonding Process for Mini Stack-Die Package	Hsiang-Chen Hsu;Shen-Wen Yu;Yu-Teng Hsu;Wei-Yaw Chang;Ming-Jer Lin;Ruei-Ming Lin;Pei-Chieh Chin;Hung-Chun Ho;Ming-Cheng Lu;Cheng-Tung Lee;Chin-Liang Chen;Chien-Hung Liao;Yu-Jung Huang;Shen-Li Fu;Li-Shan Chen
義守大學	2006	Reliability prediction for 95.5Sn3.9Ag0.6Cu solder bump and thermal design for lead free system in package with polymer-based material	Hsiang-Chen Hsu;Wei-Mao Hung
義守大學	2005-12	Reliability and thermal structure design for CMOS image sensor	Hsiang-Chen Hsu; Hui-Yu Lee; Yu-Chia Hsu; Shen-Li Fu; Chung-Chi Yang; Kuan-Chieh Huang
義守大學	2002/12/04	Thermal design and reliability of convenable MultiChip Module package on HDIIVH substrates	Hsiang-Chen Hsu ; Lih-Shan Chen ; Lee-Wei Chu
義守大學	2002	Thermal design and reliability of convenable MultiChip Module package on HDIIVH substrates	Hsiang-Chen Hsu; Lih-Shan Chen; Lee-Wei Chu

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