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Showing items 96-111 of 111  (5 Page(s) Totally)
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Institution Date Title Author
義守大學 2007/10/01 Characteristic of heat affected zone in thin gold wire and dynamic transient analysis of wire bonding for microstructure of Cu/Low-K wafer Pei-Chieh Chin ; Chin-Yuan Hu ; Hsiang-Chen Hsu ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學 2007-12 Thermal-Hygro-Mechanical Design for CMOS Image Sensor Hsiang-Chen Hsu;Hui-Yu Lee;Yu-Cha Hsu
義守大學 2007-11 Dynamic finite element analysis on underlay microstructure of Cu/low-K wafer during bonding process Hsiang-Chen Hsu; Wei-Yaw Chang; Shen-Li Fu; Chang-Lin Yeh; Yi-Shao Lai
義守大學 2007-10 Bondability Study and Correlation of Capillary Enhanced Profile with NiPdAu Pre-Plating Frame Hsiang-Chen Hsu;Jerry HS Cheng;Chun-Da Lee;Wen-Lo Shieh
義守大學 2007 Characteristic of heat affected zone in thin gold wire and dynamic transient analysis of wire bonding for microstructure of Cu/Low-K wafer Pei-Chieh Chin; Chin-Yuan Hu; Hsiang-Chen Hsu; Shen-Li Fu; Chang-Lin Yeh; Yi-Shao Lai
義守大學 2006/12/11 Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique Hsiang-Chen Hsu ; Yu-Chia Hsu ; Hm-Yu Lee ; Chang-Lin Yeh ; Yi-Shao Lai ; Shen-Li Fu
義守大學 2006/12/06 Application of submodeling technique to transient drop impact analysis of board-level stacked die packages Hsiang-Chen Hsu ; Yu-Chia Hsu ; Hui-Yu Lee ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學 2006/08/26 Parametric Study and Optimal Design in Wire Bonding Process for Mini Stack-Die Package Hsiang-Chen Hsu ; Shen-Wen Yu ; Yu-Teng Hsu ; Wei-Yaw Chang ; Ming-Jer Lin ; Ruei-Ming Lin ; Pei-Chieh Chin ; Hung-Chun Ho ; Ming-Cheng Lu ; Cheng-Tung Lee ; Chin-Liang Chen ; Chien-Hung Liao ; Yu-Jung Huang ; Shen-Li Fu ; Li-Shan Chen
義守大學 2006/08/26 A Novel Submodeling Scheme on Thermal Cycle Test for CMOS Image Sensor Hsiang-Chen Hsu ; Hui-Yu Lee ; Yu-Chia Hsu ; Chin-Yuan Hu ; Ming-Jer Lin ; Pei-Chieh Chin ; Shen-Li Fu ; Chung, M.C.L. ; Ching-Chung Tseng
義守大學 2006-12 Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique Hsiang-Chen Hsu; Yu-Chia Hsu; Hm-Yu Lee; Chang-Lin Yeh; Yi-Shao Lai; Shen-Li Fu
義守大學 2006-08 A Novel Submodeling Scheme on Thermal Cycle Test for CMOS Image Sensor Hsiang-Chen Hsu; Hui-Yu Lee; Yu-Chia Hsu; Chin-Yuan Hu; Ming-Jer Lin; Pei-Chieh Chin; Shen-Li Fu; Chung, M.C.L.; Ching-Chung Tseng
義守大學 2006-08 Parametric Study and Optimal Design in Wire Bonding Process for Mini Stack-Die Package Hsiang-Chen Hsu;Shen-Wen Yu;Yu-Teng Hsu;Wei-Yaw Chang;Ming-Jer Lin;Ruei-Ming Lin;Pei-Chieh Chin;Hung-Chun Ho;Ming-Cheng Lu;Cheng-Tung Lee;Chin-Liang Chen;Chien-Hung Liao;Yu-Jung Huang;Shen-Li Fu;Li-Shan Chen
義守大學 2006 Reliability prediction for 95.5Sn3.9Ag0.6Cu solder bump and thermal design for lead free system in package with polymer-based material Hsiang-Chen Hsu;Wei-Mao Hung
義守大學 2005-12 Reliability and thermal structure design for CMOS image sensor Hsiang-Chen Hsu; Hui-Yu Lee; Yu-Chia Hsu; Shen-Li Fu; Chung-Chi Yang; Kuan-Chieh Huang
義守大學 2002/12/04 Thermal design and reliability of convenable MultiChip Module package on HDIIVH substrates Hsiang-Chen Hsu ; Lih-Shan Chen ; Lee-Wei Chu
義守大學 2002 Thermal design and reliability of convenable MultiChip Module package on HDIIVH substrates Hsiang-Chen Hsu; Lih-Shan Chen; Lee-Wei Chu

Showing items 96-111 of 111  (5 Page(s) Totally)
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