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Showing items 1-4 of 4 (1 Page(s) Totally)
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| 中原大學 |
2002-12 |
覆晶構裝受熱循環負載作用之疲勞壽命分析與探討 The Analysis on the Fatigue Life of Flip Chip Package under Cyclic Thermomechanical Loading
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鍾文仁;蔡新春;邱建嘉;蕭振安; Jong, Wen-Ren;Tsai, Hsin-Chun;Chiu, Chien-Chia;Hsiao, Chen-An |
| 中原大學 |
2002-12 |
覆晶構裝受熱循環負載作用之疲勞壽命分析與探討 The Analysis on the Fatigue Life of Flip Chip Package Under Cyclic Thermomechanical Loading
|
鍾文仁;蔡新春;邱建嘉;蕭振安 ;Jong, Wen-Ren;Tsai, Hsin-Chun;Chiu, Chien-Chia;Hsiao, Chen-An |
| 中原大學 |
2000-12 |
PBGA錫球幾何外型對疲勞壽命之影響與探討 The Effect and Analysis of Solder Joint Geometry on the Fatigue Life of PBGA Packaging
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鍾文仁;陳俊龍;蕭振安; Jong, Wen-Ren;Chen, Chun-Lung;Hsiao, Chen-An |
| 東海大學 |
2000 |
巢狀製造系統規劃之決策支援系統
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蕭振安; Hsiao, Chen-An |
Showing items 1-4 of 4 (1 Page(s) Totally)
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