| 國立交通大學 |
2017-04-21T06:48:31Z |
Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging
|
Chiu, Wei-Lan; Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning |
| 國立交通大學 |
2015-07-21T11:20:25Z |
Extremely anisotropic single-crystal growth in nanotwinned copper
|
Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning |
| 國立交通大學 |
2014-12-16T06:15:01Z |
METHOD FOR INHIBITING GROWTH OF INTERMETALLIC COMPOUNDS
|
CHEN Chih; TU King-Ning; HSIAO Hsiang-Yao |
| 國立交通大學 |
2014-12-16T06:13:48Z |
Circuit board with twinned CU circuit layer and method for manufacturing the same
|
Chen Chih; Hsiao Hsiang-Yao |
| 國立交通大學 |
2014-12-16T06:13:48Z |
Method for inhibiting growth of intermetallic compounds
|
Chen Chih; Tu King-Ning; Hsiao Hsiang-Yao |
| 國立交通大學 |
2014-12-12T03:06:11Z |
覆晶銲錫接點在通電下焦耳熱效應及熱遷移之研究
|
蕭翔耀; Hsiao, Hsiang-Yao; 陳智; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:29:38Z |
Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy
|
Tu, K. N.; Hsiao, Hsiang-Yao; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:29:18Z |
Thermomigration in solder joints
|
Chen, Chih; Hsiao, Hsiang-Yao; Chang, Yuan-Wei; Ouyang, Fanyi; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:28:15Z |
Fabrication and Characterization of (111)-Oriented and Nanotwinned Cu by Dc Electrodeposition
|
Liu, Tao-Chi; Liu, Chien-Min; Hsiao, Hsiang-Yao; Lu, Jia-Ling; Huang, Yi-Sa; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:23:13Z |
Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper
|
Hsiao, Hsiang-Yao; Liu, Chien-Min; Lin, Han-Wen; Liu, Tao-Chi; Lu, Chia-Ling; Huang, Yi-Sa; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:19:45Z |
INVESTIGATION OF JOULE HEATING EFFECT IN VARIOUS STAGES OF FAILURE IN FLIP-CHIP SOLDER JOINTS UNDER ACCELERATED ELECTROMIGRATION
|
Hsiao, Hsiang Yao; Chen, Chih; Yao, D. J. |
| 國立交通大學 |
2014-12-08T15:14:17Z |
Thermomigration in flip-chip SnPb solder joints under alternating current stressing
|
Hsiao, Hsiang-Yao; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:13:50Z |
Erratum: "Thermomigration in flip-chip SnPb solder joints under alternate current stressing" [Appl. Phys. Lett. 90, 152105 (2007)]
|
Hsiao, Hsiang-Yao; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:11:08Z |
Direct measurement of hot-spot temperature in flip-chip solder joints under current stressing using infrared microscopy
|
Hsiao, Hsiang-Yao; Liang, S. W.; Ku, Min-Feng; Chen, Chih; Yao, Da-Jeng |
| 國立交通大學 |
2014-12-08T15:09:48Z |
Thermomigration in Pb-free SnAg solder joint under alternating current stressing
|
Hsiao, Hsiang-Yao; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:08:08Z |
Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints
|
Liang, S. W.; Hsiao, Hsiang-Yao; Chen, Chih; Xu, Luhua; Tu, K. N.; Lai, Yi-Shao |
| 國立交通大學 |
2014-12-08T15:03:39Z |
Measurement of Temperature Distribution in SnAg3.5 Flip-Chip Solder Joints during Current Stressing Using Infrared Microscopy
|
Hsiao, Hsiang-Yao; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:01:53Z |
Measurement of Temperature Distribution in SnAg3.5 Flip-Chip Solder Joints during Current Stressing Using Infrared Microscopy
|
Hsiao, Hsiang-Yao; Chen, Chih |
| 國立成功大學 |
2014-10 |
Extremely anisotropic single-crystal growth in nanotwinned copper
|
Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning |
