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Showing items 1-10 of 19 (2 Page(s) Totally)
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| 國立交通大學 |
2017-04-21T06:48:31Z |
Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging
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Chiu, Wei-Lan; Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning |
| 國立交通大學 |
2015-07-21T11:20:25Z |
Extremely anisotropic single-crystal growth in nanotwinned copper
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Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning |
| 國立交通大學 |
2014-12-16T06:15:01Z |
METHOD FOR INHIBITING GROWTH OF INTERMETALLIC COMPOUNDS
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CHEN Chih; TU King-Ning; HSIAO Hsiang-Yao |
| 國立交通大學 |
2014-12-16T06:13:48Z |
Circuit board with twinned CU circuit layer and method for manufacturing the same
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Chen Chih; Hsiao Hsiang-Yao |
| 國立交通大學 |
2014-12-16T06:13:48Z |
Method for inhibiting growth of intermetallic compounds
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Chen Chih; Tu King-Ning; Hsiao Hsiang-Yao |
| 國立交通大學 |
2014-12-12T03:06:11Z |
覆晶銲錫接點在通電下焦耳熱效應及熱遷移之研究
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蕭翔耀; Hsiao, Hsiang-Yao; 陳智; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:29:38Z |
Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy
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Tu, K. N.; Hsiao, Hsiang-Yao; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:29:18Z |
Thermomigration in solder joints
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Chen, Chih; Hsiao, Hsiang-Yao; Chang, Yuan-Wei; Ouyang, Fanyi; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:28:15Z |
Fabrication and Characterization of (111)-Oriented and Nanotwinned Cu by Dc Electrodeposition
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Liu, Tao-Chi; Liu, Chien-Min; Hsiao, Hsiang-Yao; Lu, Jia-Ling; Huang, Yi-Sa; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:23:13Z |
Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper
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Hsiao, Hsiang-Yao; Liu, Chien-Min; Lin, Han-Wen; Liu, Tao-Chi; Lu, Chia-Ling; Huang, Yi-Sa; Chen, Chih; Tu, K. N. |
Showing items 1-10 of 19 (2 Page(s) Totally)
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