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Institution Date Title Author
國立交通大學 2020-02-02T23:55:34Z Multi-Angle Bended Heat Pipe Design Using X-Architecture Routing with Dynamic Thermal Weight on Mobile Devices Hsiao, Hsuan-Hsuan; Chiou, Hong-Wen; Lee, Yu-Min
國立交通大學 2019-06-03T01:09:17Z A System-Level Thermal Simulator with Automatic Meshing Techniques Wang, Jui-Hung; Lee, Yu-Min; Hsiao, Hsuan-Hsuan; Cheng, Liang-Chia
國立交通大學 2018-08-21T05:56:59Z Thermal Modeling and Design on Smartphones with Heat Pipe Cooling Technique Chiou, Hong-Wen; Lee, Yu-Min; Hsiao, Hsuan-Hsuan; Cheng, Liang-Chia

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