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"hsieh t e"的相关文件
显示项目 11-17 / 17 (共1页)
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| 國立交通大學 |
2014-12-08T15:13:31Z |
Transparent photo-curable co-polyacrylate/silica nanocomposites prepared by sol-gel process
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Chou, Yen-Chun; Wang, Yu-Young; Hsieh, T.-E. |
| 國立交通大學 |
2014-12-08T15:12:40Z |
A study of UV-curable epoxide resins containing thermal accelerator - Tertiary amines
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Chiang, Tzu Hsuan; Hsieh, T. -E. |
| 國立臺灣科技大學 |
2013 |
The effect of Cr/Zr chemical composition ratios on the mechanical properties of CrN/ZrN multilayered coatings deposited by cathodic arc deposition system
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Chen, S.-F.;Kuo, Y.-C.;Wang, C.-J.;Huang, S.-H.;Lee, J.-W.;Chan, Y.-C.;Chen, H.-W.;Duh, J.-G.;Hsieh, T.-E. |
| 國立臺灣科技大學 |
2011 |
Mechanical and tribological properties evaluation of cathodic arc deposited CrN/ZrN multilayer coatings
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Huang, S.H.;Chen, S.F.;Kuo, Y.C.;Wang, C.J.;Lee, J.W.;Chan, Y.C.;Chen, H.W.;Duh, J.G.;Hsieh, T.E. |
| 國立成功大學 |
2005-01-24 |
Modified polycrystalline silicon chemical-vapor deposition process for improving roughness at oxide/polycrystalline silicon interface
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Chang, J. J.; Hsieh, T. E.; Wang, Y. L.; Tseng, W. T.; Liu, Chuan-Pu; Lan, C. Y. |
| 國立臺灣大學 |
2003 |
Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al2O3 with Sn interlayers
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Liang, M. W.; Hsieh, T. E.; Chang, S. Y.; Chuang, T. H. |
| 臺大學術典藏 |
2003 |
Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al2O3 with Sn interlayers
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Liang, M.W.; Hsieh, T.E.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG |
显示项目 11-17 / 17 (共1页)
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