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Institution Date Title Author
國立交通大學 2014-12-08T15:17:12Z Comparison of characteristics and integration of copper diffusion-barrier dielectrics Wang, TC; Cheng, YL; Wang, YL; Hsieh, TE; Hwang, GJ; Chen, CF
國立交通大學 2014-12-08T15:15:41Z A study of monomer's effect on adhesion strength of UV-curable resins Chiang, TH; Hsieh, TE

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